Yasumasa Hiroo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing apparatus and polishing member dressing method
- Patent number 11,945,075
- Issue date Apr 2, 2024
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing member dressing method
- Patent number 11,458,589
- Issue date Oct 4, 2022
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus and method
- Patent number 10,828,747
- Issue date Nov 10, 2020
- Ebara Corporation
- Yasumasa Hiroo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,440,327
- Issue date Sep 13, 2016
- Ebara Corporation
- Yasumasa Hiroo
- B24 - GRINDING POLISHING
Information Patent Grant
Method of correcting film thickness measurement value, film thickne...
- Patent number 9,437,507
- Issue date Sep 6, 2016
- Ebara Corporation
- Akira Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method, polishing apparatus and method of monitoring a su...
- Patent number 8,398,456
- Issue date Mar 19, 2013
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 8,246,417
- Issue date Aug 21, 2012
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 8,112,169
- Issue date Feb 7, 2012
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing monitoring method and polishing apparatus
- Patent number 8,078,419
- Issue date Dec 13, 2011
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 7,822,500
- Issue date Oct 26, 2010
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate transfer controlling apparatus and substrate transferring...
- Patent number 7,313,452
- Issue date Dec 25, 2007
- Ebara Corporation
- Yoichi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate transfer controlling apparatus and substrate transferring...
- Patent number 7,072,730
- Issue date Jul 4, 2006
- Ebara Corporation
- Yoichi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer transfer control apparatus and method for transferring wafer
- Patent number 6,772,029
- Issue date Aug 3, 2004
- Ebara Corporation
- Yoichi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE POLISHING APPARATUS
- Publication number 20240207996
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Yasumasa HIROO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD
- Publication number 20220410345
- Publication date Dec 29, 2022
- EBARA CORPORATION
- Keita YAGI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, POLISHING MONITORING METHOD AND POLISHING MONITOR...
- Publication number 20220176513
- Publication date Jun 9, 2022
- EBARA CORPORATION
- Yuki Watanabe
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR CONTROLLING DRESSING...
- Publication number 20220048160
- Publication date Feb 17, 2022
- EBARA CORPORATION
- Yasumasa HIROO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD
- Publication number 20200198094
- Publication date Jun 25, 2020
- EBARA CORPORATION
- Keita YAGI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND METHOD
- Publication number 20190009385
- Publication date Jan 10, 2019
- EBARA CORPORATION
- Yasumasa HIROO
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF CORRECTING FILM THICKNESS MEASUREMENT VALUE, FILM THICKNE...
- Publication number 20150262893
- Publication date Sep 17, 2015
- EBARA CORPORATION
- Akira NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20130344773
- Publication date Dec 26, 2013
- EBARA CORPORATION
- Yasumasa Hiroo
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20100330878
- Publication date Dec 30, 2010
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, POLISHING APPARATUS AND METHOD OF MONITORING A SU...
- Publication number 20100273396
- Publication date Oct 28, 2010
- Yoichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and polishing method
- Publication number 20100029177
- Publication date Feb 4, 2010
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
Polishing monitoring method and polishing apparatus
- Publication number 20090104847
- Publication date Apr 23, 2009
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Apparatus And Polishing Method
- Publication number 20070243795
- Publication date Oct 18, 2007
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
Substrate transfer controlling apparatus and substrate transferring...
- Publication number 20060161286
- Publication date Jul 20, 2006
- Yoichi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Substrate transfer controlling apparatus and substrate transferring...
- Publication number 20040249494
- Publication date Dec 9, 2004
- Yoichi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wafer transfer control apparatus and method for transferring wafer
- Publication number 20020192055
- Publication date Dec 19, 2002
- Yoichi Kobayachi
- G06 - COMPUTING CALCULATING COUNTING

Yasumasa Hiroo

Person

Patents Grantslast 30 patents

Polishing apparatus and polishing member dressing method

Polishing apparatus and polishing member dressing method

Substrate polishing apparatus and method

Polishing apparatus and polishing method

Method of correcting film thickness measurement value, film thickne...

Polishing method, polishing apparatus and method of monitoring a su...

Polishing apparatus and polishing method

Polishing apparatus and polishing method

Polishing monitoring method and polishing apparatus

Polishing apparatus and polishing method

Substrate transfer controlling apparatus and substrate transferring...

Substrate transfer controlling apparatus and substrate transferring...

Wafer transfer control apparatus and method for transferring wafer

Patents Applicationslast 30 patents

SUBSTRATE POLISHING APPARATUS

POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD

POLISHING METHOD, POLISHING MONITORING METHOD AND POLISHING MONITOR...

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR CONTROLLING DRESSING...

POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD

SUBSTRATE POLISHING APPARATUS AND METHOD

METHOD OF CORRECTING FILM THICKNESS MEASUREMENT VALUE, FILM THICKNE...

POLISHING APPARATUS AND POLISHING METHOD

POLISHING APPARATUS AND POLISHING METHOD

POLISHING METHOD, POLISHING APPARATUS AND METHOD OF MONITORING A SU...

Polishing apparatus and polishing method

Polishing monitoring method and polishing apparatus

Polishing Apparatus And Polishing Method

Substrate transfer controlling apparatus and substrate transferring...

Substrate transfer controlling apparatus and substrate transferring...

Wafer transfer control apparatus and method for transferring wafer