Yasumasa Iwata

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing mold material and method for manufacturing st...
- Patent number 10,607,876
- Issue date Mar 31, 2020
- Tokyo Ohka Kogyo Co., Ltd.
- Yasushi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, laminate, and stripping method
- Patent number 9,881,829
- Issue date Jan 30, 2018
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 9,682,541
- Issue date Jun 20, 2017
- TOKOY OHKA KOGYO CO., LTD.
- Hirofumi Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting member separation method
- Patent number 9,627,235
- Issue date Apr 18, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Yasumasa Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, laminate, and stripping method
- Patent number 9,607,875
- Issue date Mar 28, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attachment method
- Patent number 9,484,238
- Issue date Nov 1, 2016
- Tokyo Ohka Kogyo Co., Ltd.
- Yoshihiro Inao
- B24 - GRINDING POLISHING
Information Patent Grant
Treatment device, treatment method, and surface treatment jig
- Patent number 9,129,999
- Issue date Sep 8, 2015
- Tokyo Ohka Kogyo Co., Ltd.
- Yasumasa Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perforated support plate
- Patent number 8,882,096
- Issue date Nov 11, 2014
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid solvent abutment unit
- Patent number 8,449,691
- Issue date May 28, 2013
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stripping device and stripping method
- Patent number 8,377,256
- Issue date Feb 19, 2013
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treatment apparatus
- Patent number 8,371,317
- Issue date Feb 12, 2013
- Tokyo Ohka Kogyo Co., Ltd.
- Yasumasa Iwata
- B08 - CLEANING
Information Patent Grant
Stripping device and stripping method
- Patent number 8,302,651
- Issue date Nov 6, 2012
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Separating apparatus and separating method
- Patent number 8,297,331
- Issue date Oct 30, 2012
- Tokyo Ohka Kogyo Co., Ltd.
- Yoshihiro Inao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Separating device
- Patent number 8,186,410
- Issue date May 29, 2012
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Treatment liquid permeation unit and treating apparatus
- Patent number 8,181,660
- Issue date May 22, 2012
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of thinning wafer and support plate
- Patent number 8,167,687
- Issue date May 1, 2012
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUPPORT BODY SEPARATING DEVICE AND SUPPORT BODY SEPARATING METHOD
- Publication number 20180233385
- Publication date Aug 16, 2018
- Tokyo Ohka Kogyo Co., Ltd.
- Yasumasa Iwata
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD
- Publication number 20170148659
- Publication date May 25, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro YOSHIOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
ATTACHMENT METHOD
- Publication number 20160005635
- Publication date Jan 7, 2016
- Tokyo Ohka Kogyo Co., Ltd.
- Yoshihiro Inao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING MEMBER SEPARATION METHOD
- Publication number 20150325465
- Publication date Nov 12, 2015
- Tokyo Ohka Kogyo Co., Ltd.
- Yasumasa Iwata
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD
- Publication number 20150299534
- Publication date Oct 22, 2015
- Tokyo Ohka Kogyo Co., Ltd.
- Takahiro Yoshioka
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING METHOD
- Publication number 20150165741
- Publication date Jun 18, 2015
- Tokyo Ohka Kogyo Co., Ltd.
- Hirofumi Imai
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PROCESSING MOLD MATERIAL AND METHOD FOR MANUFACTURING ST...
- Publication number 20140332149
- Publication date Nov 13, 2014
- Tokyo Ohka Kogyo Co., Ltd.
- Yasushi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORATED SUPPORT PLATE
- Publication number 20130333833
- Publication date Dec 19, 2013
- Akihiko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPING DEVICE AND STRIPPING METHOD
- Publication number 20130000852
- Publication date Jan 3, 2013
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Application
STRIPPING DEVICE AND STRIPPING METHOD
- Publication number 20110259527
- Publication date Oct 27, 2011
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Application
TREATMENT DEVICE, TREATMENT METHOD, AND SURFACE TREATMENT JIG
- Publication number 20100037916
- Publication date Feb 18, 2010
- Yasumasa Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID SOLVENT ABUTMENT UNIT
- Publication number 20100024853
- Publication date Feb 4, 2010
- Akihiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING APPARATUS AND SEPARATING METHOD
- Publication number 20100000680
- Publication date Jan 7, 2010
- Yoshihiro INAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Thinning Wafer and Support plate
- Publication number 20090325467
- Publication date Dec 31, 2009
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- B24 - GRINDING POLISHING
Information Patent Application
Supporting plate peeling apparatus
- Publication number 20090314438
- Publication date Dec 24, 2009
- Tokyo Ohka Kogyo Co., Ltd.
- Yasumasa Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORATED SUPPORT PLATE
- Publication number 20090288780
- Publication date Nov 26, 2009
- Akihiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment liquid permeation unit and treating apparatus
- Publication number 20090218050
- Publication date Sep 3, 2009
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING DEVICE
- Publication number 20090139662
- Publication date Jun 4, 2009
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface treatment apparatus
- Publication number 20090056767
- Publication date Mar 5, 2009
- Tokyo Ohka Kogyo Co., Ltd.
- Yasumasa Iwata
- B08 - CLEANING

Yasumasa Iwata

Person

Patents Grantslast 30 patents

Method for processing mold material and method for manufacturing st...

Adhesive composition, laminate, and stripping method

Bonding method

Supporting member separation method

Adhesive composition, laminate, and stripping method

Attachment method

Treatment device, treatment method, and surface treatment jig

Perforated support plate

Liquid solvent abutment unit

Stripping device and stripping method

Surface treatment apparatus

Stripping device and stripping method

Separating apparatus and separating method

Separating device

Treatment liquid permeation unit and treating apparatus

Method of thinning wafer and support plate

Patents Applicationslast 30 patents

SUPPORT BODY SEPARATING DEVICE AND SUPPORT BODY SEPARATING METHOD

ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD

ATTACHMENT METHOD

SUPPORTING MEMBER SEPARATION METHOD

ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD

BONDING METHOD

METHOD FOR PROCESSING MOLD MATERIAL AND METHOD FOR MANUFACTURING ST...

PERFORATED SUPPORT PLATE

STRIPPING DEVICE AND STRIPPING METHOD

STRIPPING DEVICE AND STRIPPING METHOD

TREATMENT DEVICE, TREATMENT METHOD, AND SURFACE TREATMENT JIG

LIQUID SOLVENT ABUTMENT UNIT

SEPARATING APPARATUS AND SEPARATING METHOD

Method of Thinning Wafer and Support plate

Supporting plate peeling apparatus

PERFORATED SUPPORT PLATE

Treatment liquid permeation unit and treating apparatus

SEPARATING DEVICE

Surface treatment apparatus