Yasunaga Kurokawa

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for fabricating a thin multi-layer circuit board
- Patent number 6,389,686
- Issue date May 21, 2002
- Fujitsu Limited
- Yasuhito Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin multi-layer circuit board having a remodeling pad layer and a...
- Patent number 6,184,476
- Issue date Feb 6, 2001
- Fujitsu Ltd.
- Yasuhito Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin multi-layer circuit board and process for fabricating the same
- Patent number 5,679,268
- Issue date Oct 21, 1997
- Fujitsu Limited
- Yasuhito Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Process for fabricating a thin multi-layer circuit board
- Publication number 20010015008
- Publication date Aug 23, 2001
- Yasuhito Takahashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC