Yasunobu Ikeda

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...
- Patent number 7,528,049
- Issue date May 5, 2009
- Sumco Corporation
- Yasunobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable electronic equipment and battery mounting device of the eq...
- Patent number 7,043,282
- Issue date May 9, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoji Inomata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Portable telephone
- Patent number 6,968,161
- Issue date Nov 22, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoji Inomata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Card holding structure and portable terminal apparatus having the same
- Patent number 6,947,767
- Issue date Sep 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideo Haga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Card connector and portable telephone having the same
- Patent number 6,942,154
- Issue date Sep 13, 2005
- Matsushita Electric Industrial Co, Ltd.
- Hideo Haga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board holding structure
- Patent number 6,809,933
- Issue date Oct 26, 2004
- Matsushita Electric Industrial Eo., Ltd.
- Koji Kuchiishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for bonding substrates
- Patent number 6,620,285
- Issue date Sep 16, 2003
- Sumitomo Metal Industries
- Shinichi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal battery holding structure in mobile equipment
- Patent number 6,515,450
- Issue date Feb 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kaiho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic equipment device having clamps
- Patent number 5,636,105
- Issue date Jun 3, 1997
- Matsushita Electric Industrial Co., Ltd.
- Youji Inomata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...
- Publication number 20080020541
- Publication date Jan 24, 2008
- Yasunobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Portable electronic equipment and battery mounting device of the eq...
- Publication number 20040048638
- Publication date Mar 11, 2004
- Yoji Inomata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Card holding structure and portable terminal apparatus having the same
- Publication number 20030134602
- Publication date Jul 17, 2003
- Hideo Haga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Printed circuit board holding structure
- Publication number 20030007333
- Publication date Jan 9, 2003
- Koji Kuchiishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for bonding substrates
- Publication number 20020040754
- Publication date Apr 11, 2002
- Shinichi Tomita
- B32 - LAYERED PRODUCTS
Information Patent Application
Portable telephone
- Publication number 20010024945
- Publication date Sep 27, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yoji Inomata
- H01 - BASIC ELECTRIC ELEMENTS

Yasunobu Ikeda

Person

Patents Grantslast 30 patents

Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...

Portable electronic equipment and battery mounting device of the eq...

Portable telephone

Card holding structure and portable terminal apparatus having the same

Card connector and portable telephone having the same

Printed circuit board holding structure

Method for bonding substrates

Internal battery holding structure in mobile equipment

Electronic equipment device having clamps

Patents Applicationslast 30 patents

Method for manufacturing bonded SOI wafer and bonded SOI wafer manu...

Portable electronic equipment and battery mounting device of the eq...

Card holding structure and portable terminal apparatus having the same

Printed circuit board holding structure

Method for bonding substrates

Portable telephone