Yasunobu IWAMOTO

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Koshi City, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding device and bonding system
- Patent number 9,694,572
- Issue date Jul 4, 2017
- Tokyo Electron Limited
- Shintaro Sugihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING DEVICE AND BONDING SYSTEM
- Publication number 20150129137
- Publication date May 14, 2015
- TOKYO ELECTRON LIMITED
- Shintaro SUGIHARA
- B32 - LAYERED PRODUCTS