Yasunobu Oikawa

Person

Akita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor
- Patent number 9,711,283
- Issue date Jul 18, 2017
- TDK Corporation
- Tatsuo Namikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor
- Patent number 9,564,270
- Issue date Feb 7, 2017
- TDK Corporation
- Junji Aotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor
- Patent number 9,111,681
- Issue date Aug 18, 2015
- TDK Corporation
- Hitoshi Saita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor
- Patent number 9,076,600
- Issue date Jul 7, 2015
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor
- Patent number 9,030,800
- Issue date May 12, 2015
- TDK Corporation
- Tatsuo Namikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a thin film capacitor having separated diel...
- Patent number 8,997,321
- Issue date Apr 7, 2015
- TDK Corporation
- Eiju Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor and manufacturing method thereof
- Patent number 8,605,410
- Issue date Dec 10, 2013
- TDK Corporation
- Yasunobu Oikawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film capacitor with internally hollow through holes
- Patent number 8,498,095
- Issue date Jul 30, 2013
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric device and method of manufacturing dielectric device
- Patent number 8,435,645
- Issue date May 7, 2013
- TDK Corporation
- Akira Shibue
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film capacitor
- Patent number 8,411,411
- Issue date Apr 2, 2013
- TDK Corporation
- Yasunobu Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing thin film capacitor and thin film capacitor
- Patent number 8,339,766
- Issue date Dec 25, 2012
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic component module
- Patent number 8,294,036
- Issue date Oct 23, 2012
- TDK Corporation
- Shinichiro Kakei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and electronic component module
- Patent number 8,149,584
- Issue date Apr 3, 2012
- TDK Corporation
- Hitoshi Saita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate and manufacturing method thereof, integrated ci...
- Patent number 7,132,310
- Issue date Nov 7, 2006
- TDK Corporation
- Masahiro Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and manufacturing method thereof, integrated ci...
- Patent number 7,015,556
- Issue date Mar 21, 2006
- TDK Corporation
- Masahiro Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductive ceramic composition and semiconductive ceramic capac...
- Patent number 4,854,936
- Issue date Aug 8, 1989
- TDK Corporation
- Shuichi Ono
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductive ceramic composition and semiconductor ceramic capacitor
- Patent number 4,799,127
- Issue date Jan 17, 1989
- TDK Corporation
- Shuichi Ono
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Non-linear dielectric element
- Patent number 4,447,549
- Issue date May 8, 1984
- TDK Kabushiki Kaisha
- Sho Masujima
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Non-linear polycrystalline barium titanate-type dielectric element
- Patent number 4,404,029
- Issue date Sep 13, 1983
- TDK Electronics Co., Ltd.
- Shoichi Iwaya
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM CAPACITOR
- Publication number 20150325368
- Publication date Nov 12, 2015
- TDK Corporation
- Tatsuo NAMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR
- Publication number 20150235767
- Publication date Aug 20, 2015
- TDK Corporation
- Junji AOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR
- Publication number 20130342960
- Publication date Dec 26, 2013
- Hitoshi SAITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR
- Publication number 20130258545
- Publication date Oct 3, 2013
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR
- Publication number 20130258544
- Publication date Oct 3, 2013
- TDK Corporation
- Tatsuo NAMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR
- Publication number 20130128410
- Publication date May 23, 2013
- TDK Corporation
- Yoshihiko YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR
- Publication number 20130071555
- Publication date Mar 21, 2013
- TDK Corporation
- Yoshihiko YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR
- Publication number 20130071554
- Publication date Mar 21, 2013
- TDK Corporation
- Yoshihiko YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130048596
- Publication date Feb 28, 2013
- TDK Corporation
- Eiju KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20110128669
- Publication date Jun 2, 2011
- TDK Corporation
- Yoshihiko YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20110075319
- Publication date Mar 31, 2011
- TDK Corporation
- Yasunobu OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20110075317
- Publication date Mar 31, 2011
- TDK Corporation
- Yasunobu OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC DEVICE AND METHOD OF MANUFACTURING DIELECTRIC DEVICE
- Publication number 20100260981
- Publication date Oct 14, 2010
- TDK Corporation
- Akira SHIBUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR
- Publication number 20100246089
- Publication date Sep 30, 2010
- TDK Corporation
- Yoshihiko YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100246091
- Publication date Sep 30, 2010
- TDK Corporation
- Eiju KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE
- Publication number 20090242256
- Publication date Oct 1, 2009
- TDK Corporation
- Hitoshi Saita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE
- Publication number 20090242257
- Publication date Oct 1, 2009
- TDK Corporation
- Shinichiro Kakei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging substrate and manufacturing method thereof, integrated ci...
- Publication number 20060134834
- Publication date Jun 22, 2006
- TDK Corporation
- Masahiro Nakano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Wiring board and wiring board manufacturing method
- Publication number 20060065439
- Publication date Mar 30, 2006
- TDK Corporation
- Yasunobu Oikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging substrate and manufacturing method thereof, integrated ci...
- Publication number 20040251560
- Publication date Dec 16, 2004
- TDK Corporation
- Masahiro Nakano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Packaging substrate and manufacturing method thereof, integrated ci...
- Publication number 20030137039
- Publication date Jul 24, 2003
- TDK Corporation
- Masahiro Nakano
- H03 - BASIC ELECTRONIC CIRCUITRY

Yasunobu Oikawa

Person

Patents Grantslast 30 patents

Thin film capacitor

Thin film capacitor

Thin film capacitor

Thin film capacitor

Thin film capacitor

Method of manufacturing a thin film capacitor having separated diel...

Thin-film capacitor and manufacturing method thereof

Thin-film capacitor with internally hollow through holes

Dielectric device and method of manufacturing dielectric device

Thin-film capacitor

Method of manufacturing thin film capacitor and thin film capacitor

Electronic component and electronic component module

Electronic component and electronic component module

Packaging substrate and manufacturing method thereof, integrated ci...

Packaging substrate and manufacturing method thereof, integrated ci...

Semiconductive ceramic composition and semiconductive ceramic capac...

Semiconductive ceramic composition and semiconductor ceramic capacitor

Non-linear dielectric element

Non-linear polycrystalline barium titanate-type dielectric element

Patents Applicationslast 30 patents

THIN FILM CAPACITOR

THIN FILM CAPACITOR

THIN FILM CAPACITOR

THIN FILM CAPACITOR

THIN FILM CAPACITOR

METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR

METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR

METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR

THIN FILM CAPACITOR AND METHOD OF MANUFACTURING THE SAME

THIN-FILM CAPACITOR

THIN-FILM CAPACITOR

THIN-FILM CAPACITOR AND MANUFACTURING METHOD THEREOF

DIELECTRIC DEVICE AND METHOD OF MANUFACTURING DIELECTRIC DEVICE

METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR

THIN FILM CAPACITOR AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE

Packaging substrate and manufacturing method thereof, integrated ci...

Wiring board and wiring board manufacturing method

Packaging substrate and manufacturing method thereof, integrated ci...

Packaging substrate and manufacturing method thereof, integrated ci...