Yasunori Ninomiya

Person

  • Kariya-city, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Sensor device

    • Patent number 7,541,574
    • Issue date Jun 2, 2009
    • Denso Corporation
    • Yasunori Ninomiya
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Conductive adhesive

    • Patent number 7,524,893
    • Issue date Apr 28, 2009
    • Harima Chemicals, Inc.
    • Nobuto Terada
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Method of producing circuit board

    • Patent number 7,458,150
    • Issue date Dec 2, 2008
    • Denso Corporation
    • Masashi Totokawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Conductive adhesive, method of producing the same, and bonding method

    • Patent number 7,357,883
    • Issue date Apr 15, 2008
    • Denso Corporation
    • Yasunori Ninomiya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    VIRTUAL IMAGE DISPLAY APPARATUS

    • Publication number 20240116364
    • Publication date Apr 11, 2024
    • DENSO CORPORATION
    • Yasunori NINOMIYA
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    VIRTUAL IMAGE DISPLAY DEVICE

    • Publication number 20210349313
    • Publication date Nov 11, 2021
    • DENSO CORPORATION
    • Yasunori NINOMIYA
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    Method of formation or thermal spray coating

    • Publication number 20110034032
    • Publication date Feb 10, 2011
    • DENSO CORPORATION
    • Toshiki Itoh
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Sensor device

    • Publication number 20070284713
    • Publication date Dec 13, 2007
    • DENSO CORPORATION
    • Yasunori Ninomiya
    • G01 - MEASURING TESTING
  • Information Patent Application

    Conductive adhesive

    • Publication number 20070185243
    • Publication date Aug 9, 2007
    • Nobuto Terada
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    Sensor having semiconductor chip and circuit chip

    • Publication number 20070090536
    • Publication date Apr 26, 2007
    • DENSO CORPORATION
    • Minekazu Sakai
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Method of producing circuit board

    • Publication number 20070074391
    • Publication date Apr 5, 2007
    • DENSO CORPORATION
    • Masashi Totokawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Conductive adhesive, method of producing the same, and bonding method

    • Publication number 20070075299
    • Publication date Apr 5, 2007
    • DENSO CORPORATION
    • Yasunori Ninomiya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR