Yasunori Ohkubo

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate, semiconductor device, and processes of pro...
- Patent number 6,846,723
- Issue date Jan 25, 2005
- Sony Corporation
- Yasunori Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor device, and processes of pro...
- Patent number 6,580,128
- Issue date Jun 17, 2003
- Sony Corporation
- Yasunori Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having a semiconductor layer, and method for fabricating...
- Patent number 6,503,811
- Issue date Jan 7, 2003
- Sony Corporation
- Yasunori Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the production of semiconductor substrate having silico...
- Patent number 6,169,000
- Issue date Jan 2, 2001
- Sony Corporation
- Yasunori Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for wafer bonding
- Patent number 5,769,991
- Issue date Jun 23, 1998
- Sony Corporation
- Yoshihiro Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor substrate, semiconductor device, and processes of pro...
- Publication number 20040007739
- Publication date Jan 15, 2004
- Yasunori Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, semiconductor device, and processes of pro...
- Publication number 20010007367
- Publication date Jul 12, 2001
- Yasunori Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS