Yasunori TANAKA

Person

Yokosuka Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laminate of aramid paper sheet and polyimide film and method for pr...
- Patent number 10,836,112
- Issue date Nov 17, 2020
- Dupont Teijin Advanced Papers (JAPAN), Ltd.
- Koichi Ukigaya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electromagnetic wave suppression sheet
- Patent number 10,654,247
- Issue date May 19, 2020
- Dupont Teijin Advanced Papers (JAPAN), Ltd.
- Shinji Naruse
- B32 - LAYERED PRODUCTS
Information Patent Grant
Motor bobbin
- Patent number 10,050,486
- Issue date Aug 14, 2018
- Dupont Teijin Advanced Papers (JAPAN), Ltd.
- Shinji Naruse
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Charge pump circuit and step-down regulator circuit
- Patent number 9,929,646
- Issue date Mar 27, 2018
- Kabushiki Kaisha Toshiba
- Koichi Notoya
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Motor bobbin
- Patent number 9,812,916
- Issue date Nov 7, 2017
- Dupont Teijin Advanced Papers (JAPAN), Ltd.
- Shinji Naruse
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Motor bobbin and method for manufacturing same
- Patent number 9,808,972
- Issue date Nov 7, 2017
- Dupont Teijin Advanced Papers (JAPAN), Ltd.
- Shinji Naruse
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Motor bobbin and method for manufacturing same
- Patent number 9,776,348
- Issue date Oct 3, 2017
- Dupont Teijin Advanced Papers (JAPAN), Ltd.
- Shinji Naruse
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Aromatic polyamide and epoxy group-containing phenoxy resin
- Patent number 7,888,434
- Issue date Feb 15, 2011
- Nitto Shinko Corporation
- Yasuyuki Kihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate sheet
- Patent number 7,713,892
- Issue date May 11, 2010
- Nitto Shinko Corporation
- Yasuyuki Kihara
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High-strength solder joint
- Patent number 6,919,137
- Issue date Jul 19, 2005
- NEC Corporation
- Kazuyuki Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-strength solder joint
- Patent number 6,669,077
- Issue date Dec 30, 2003
- NEC Corporation
- Kazuyuki Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing wiring board
- Patent number 6,377,465
- Issue date Apr 23, 2002
- NEC Corporation
- Yasunori Tanaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure and method for mounting a saw device
- Patent number 6,078,123
- Issue date Jun 20, 2000
- NEC Corporation
- Kei Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with improved connection reliability
- Patent number 6,013,953
- Issue date Jan 11, 2000
- NEC Corporation
- Toshiyuki Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package device mountable on a mother board in whichever of fac...
- Patent number 5,969,417
- Issue date Oct 19, 1999
- NEC Corporation
- Koji Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface circuit between different potential levels
- Patent number 5,963,055
- Issue date Oct 5, 1999
- Kabushiki Kaisha Toshiba
- Yasunori Tanaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip package device mountable on a mother board in whichever of fac...
- Patent number 5,909,055
- Issue date Jun 1, 1999
- NEC Corporation
- Koji Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Level conversion circuit and semiconductor integrated circuit
- Patent number 5,880,617
- Issue date Mar 9, 1999
- Kabushiki Kaisha Toshiba
- Yasunori Tanaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Interface circuit for use in a semiconductor integrated circuit
- Patent number 5,841,619
- Issue date Nov 24, 1998
- Kabushiki Kaisha Toshiba
- Hiroshi Shigehara
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bear chip mounting printed circuit board and a method of manufactur...
- Patent number 5,831,833
- Issue date Nov 3, 1998
- NEC Corporation
- Hirotsugu Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI chip having programmable buffer circuit
- Patent number 5,804,987
- Issue date Sep 8, 1998
- Kabushiki Kaisha Toshiba
- Kyohsuke Ogawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Output circuit device preventing overshoot and undershoot
- Patent number 5,801,550
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Yasunori Tanaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device mounting and multi-chip module
- Patent number 5,801,438
- Issue date Sep 1, 1998
- NEC Corporation
- Hirotsugu Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit for suppressing overshooting and r...
- Patent number 5,680,068
- Issue date Oct 21, 1997
- Kabushiki Kaisha Toshiba
- Shinji Ochi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Gate array semiconductor circuit device, input circuit, output circ...
- Patent number 5,352,942
- Issue date Oct 4, 1994
- Kabushiki Kaisha Toshiba
- Yasunori Tanaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor input/output circuits operating at different power su...
- Patent number 5,347,150
- Issue date Sep 13, 1994
- Kabushiki Kaisha Toshiba
- Izumi Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar transistor/insulated gate transistor hybrid semiconductor d...
- Patent number 5,272,366
- Issue date Dec 21, 1993
- Kabushiki Kaisha Toshiba
- Toshikazu Sei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping circuit for preventing output driving transistor from deep...
- Patent number 5,239,216
- Issue date Aug 24, 1993
- Kabushiki Kaisha Toshiba
- Toshikazu Sei
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor integrated circuit device having pads at periphery of...
- Patent number 5,216,280
- Issue date Jun 1, 1993
- Kabushiki Kaisha Toshiba
- Yasunori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS output buffer with pre-drive circuitry to control slew rate of...
- Patent number 5,216,293
- Issue date Jun 1, 1993
- Kabushiki Kaisha Toshiba
- Toshikazu Sei
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMAGNETIC WAVE ABSORBING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20210045269
- Publication date Feb 11, 2021
- DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
- Shinji NARUSE
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTROMAGNETIC WAVE ABSORBING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20210029854
- Publication date Jan 28, 2021
- DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
- Shinji NARUSE
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
ELECTROMAGNETIC WAVE SUPPRESSION SHEET
- Publication number 20200061966
- Publication date Feb 27, 2020
- DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
- Shinji NARUSE
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATE OF ARAMID PAPER SHEET AND POLYIMIDE FILM AND METHOD FOR PR...
- Publication number 20190061270
- Publication date Feb 28, 2019
- DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
- Koichi UKIGAYA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHARGE PUMP CIRCUIT AND STEP-DOWN REGULATOR CIRCUIT
- Publication number 20170179819
- Publication date Jun 22, 2017
- Kabushiki Kaisha Toshiba
- Koichi NOTOYA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOTOR BOBBIN AND METHOD FOR MANUFACTURING SAME
- Publication number 20160214291
- Publication date Jul 28, 2016
- DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
- Shinji NARUSE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOTOR BOBBIN
- Publication number 20150303756
- Publication date Oct 22, 2015
- DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
- Shinji NARUSE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOTOR BOBBIN
- Publication number 20150288238
- Publication date Oct 8, 2015
- DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
- Shinji Naruse
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN COMPOSITION
- Publication number 20090215968
- Publication date Aug 27, 2009
- NITTO SHINKO CORPORATION
- Yasuyuki Kihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAMINATE SHEET
- Publication number 20090047858
- Publication date Feb 19, 2009
- NITTO SHINKO CORPORATION
- Yasuyuki Kihara
- B32 - LAYERED PRODUCTS
Information Patent Application
High-strength solder joint
- Publication number 20040058192
- Publication date Mar 25, 2004
- NEC Corporation
- Kazuyuki Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting structure of semiconductor package
- Publication number 20020014346
- Publication date Feb 7, 2002
- NEC Corporation
- Kimio Tsunemasu
- H01 - BASIC ELECTRIC ELEMENTS

Yasunori TANAKA

Person

Patents Grantslast 30 patents

Laminate of aramid paper sheet and polyimide film and method for pr...

Electromagnetic wave suppression sheet

Motor bobbin

Charge pump circuit and step-down regulator circuit

Motor bobbin

Motor bobbin and method for manufacturing same

Motor bobbin and method for manufacturing same

Aromatic polyamide and epoxy group-containing phenoxy resin

Laminate sheet

High-strength solder joint

High-strength solder joint

Printing wiring board

Structure and method for mounting a saw device

Semiconductor device with improved connection reliability

Chip package device mountable on a mother board in whichever of fac...

Interface circuit between different potential levels

Chip package device mountable on a mother board in whichever of fac...

Level conversion circuit and semiconductor integrated circuit

Interface circuit for use in a semiconductor integrated circuit

Bear chip mounting printed circuit board and a method of manufactur...

LSI chip having programmable buffer circuit

Output circuit device preventing overshoot and undershoot

Semiconductor device mounting and multi-chip module

Semiconductor integrated circuit for suppressing overshooting and r...

Gate array semiconductor circuit device, input circuit, output circ...

Semiconductor input/output circuits operating at different power su...

Bipolar transistor/insulated gate transistor hybrid semiconductor d...

Clamping circuit for preventing output driving transistor from deep...

Semiconductor integrated circuit device having pads at periphery of...

CMOS output buffer with pre-drive circuitry to control slew rate of...

Patents Applicationslast 30 patents

ELECTROMAGNETIC WAVE ABSORBING SHEET AND METHOD FOR PRODUCING SAME

ELECTROMAGNETIC WAVE ABSORBING SHEET AND METHOD FOR PRODUCING SAME

ELECTROMAGNETIC WAVE SUPPRESSION SHEET

LAMINATE OF ARAMID PAPER SHEET AND POLYIMIDE FILM AND METHOD FOR PR...

CHARGE PUMP CIRCUIT AND STEP-DOWN REGULATOR CIRCUIT

MOTOR BOBBIN AND METHOD FOR MANUFACTURING SAME

MOTOR BOBBIN

MOTOR BOBBIN

RESIN COMPOSITION

LAMINATE SHEET

High-strength solder joint

Mounting structure of semiconductor package