Yasuo Inada

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of polishing copper layer of substrate
- Patent number 6,797,626
- Issue date Sep 28, 2004
- Fujikoshi Machinery Corp.
- Noriko Miyairi
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive system
- Patent number 6,361,418
- Issue date Mar 26, 2002
- Fujikoshi Kikai Kogyo Kabushiki Kaisha
- Yasuo Inada
- B24 - GRINDING POLISHING
Information Patent Grant
Method of and apparatus for mirror-like polishing wafer chamfer wit...
- Patent number 6,332,828
- Issue date Dec 25, 2001
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of and apparatus for mirror-like polishing wafer chamfer wit...
- Patent number 6,113,463
- Issue date Sep 5, 2000
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing peripheral portion of wafer
- Patent number 5,928,066
- Issue date Jul 27, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing machine
- Patent number 5,879,225
- Issue date Mar 9, 1999
- Fujikoshi Kikai Kogyo Kabushiki Kaisha
- Michio Kudo
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing peripheral portion of wafer
- Patent number 5,766,065
- Issue date Jun 16, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the notch of a wafer
- Patent number 5,733,181
- Issue date Mar 31, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for mirror-polishing chamfered portion of wafer and mirror-p...
- Patent number 5,727,990
- Issue date Mar 17, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 5,549,502
- Issue date Aug 27, 1996
- Fujikoshi Machinery Corp.
- Kohichi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the periphery portion of a wafer
- Patent number 5,476,413
- Issue date Dec 19, 1995
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method of polishing copper layer of substrate
- Publication number 20030124862
- Publication date Jul 3, 2003
- Fujikoshi Machinery Corp.
- Noriko Miyairi
- B24 - GRINDING POLISHING

Yasuo Inada

Person

Patents Grantslast 30 patents

Method of polishing copper layer of substrate

Abrasive system

Method of and apparatus for mirror-like polishing wafer chamfer wit...

Method of and apparatus for mirror-like polishing wafer chamfer wit...

Apparatus for polishing peripheral portion of wafer

Polishing machine

Apparatus for polishing peripheral portion of wafer

Apparatus for polishing the notch of a wafer

Method for mirror-polishing chamfered portion of wafer and mirror-p...

Polishing apparatus

Apparatus for polishing the periphery portion of a wafer

Patents Applicationslast 30 patents

Method of polishing copper layer of substrate