Yasuo Kawamura

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor unit and cooling device
- Patent number 6,396,701
- Issue date May 28, 2002
- Fujitsu Limited
- Naoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of wirebond pad repair and reuse
- Patent number 5,550,083
- Issue date Aug 27, 1996
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reformed pad
- Patent number 5,455,461
- Issue date Oct 3, 1995
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of flat-lead package-type electronic component
- Patent number 4,703,393
- Issue date Oct 27, 1987
- Fujitsu Ltd.
- Tsuyoshi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR