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Yasuo Kawashima
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Method of manufacturing multi-layer printed wiring board
Patent number
6,664,127
Issue date
Dec 16, 2003
Mitsubishi Denki Kabushiki Kaisha
Seiji Oka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Method of manufacturing multi-layer printed wiring board
Patent number
6,451,710
Issue date
Sep 17, 2002
Mitsubishi Denki Kabushiki Kaisha
Seiji Oka
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Method of manufacturing multi-layer printed wiring board
Publication number
20020023343
Publication date
Feb 28, 2002
Seiji Oka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method of manufacturing multi-layer printed wiring board
Publication number
20020016018
Publication date
Feb 7, 2002
Seiji Oka
H01 - BASIC ELECTRIC ELEMENTS