Yasuo SASAKI

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Yokohama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
RF waveguide cable assembly
- Patent number 12,087,989
- Issue date Sep 10, 2024
- Samtec, Inc.
- Marc Epitaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical cable with dielectric foam
- Patent number 11,605,480
- Issue date Mar 14, 2023
- Samtec, Inc.
- Shashi Chuganey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOSSY MATERIAL FOR IMPROVED SIGNAL INTEGRITY
- Publication number 20220224060
- Publication date Jul 14, 2022
- SAMTEC, INC.
- Jonathan E. BUCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF WAVEGUIDE CABLE ASSEMBLY
- Publication number 20220216581
- Publication date Jul 7, 2022
- SAMTEC, INC.
- Marc EPITAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CABLE WITH DIELECTRIC FOAM
- Publication number 20210383946
- Publication date Dec 9, 2021
- SAMTEC, INC.
- Shashi CHUGANEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOSSY MATERIAL FOR IMPROVED SIGNAL INTEGRITY
- Publication number 20210320461
- Publication date Oct 14, 2021
- SAMTEC, INC.
- Jonathan E. Buck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CABLE WITH ELECTRICALLY CONDUCTIVE COATING
- Publication number 20210217542
- Publication date Jul 15, 2021
- SAMTEC, INC.
- Shashi CHUGANEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS WITH METAMATERIALS
- Publication number 20210013653
- Publication date Jan 14, 2021
- SAMTEC, INC.
- Yasuo SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR