Yasuo Souki

Person

Toyota-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor dynamic sensor and method of manufacturing the same
- Patent number 7,572,659
- Issue date Aug 11, 2009
- Denso Corporation
- Koichi Tsubaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for separating semiconductor substrate
- Patent number 7,550,367
- Issue date Jun 23, 2009
- Denso Corporation
- Muneo Tamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a flat protective adhesive sheet
- Patent number 6,787,929
- Issue date Sep 7, 2004
- Denso Corporation
- Shinji Yoshihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor wafer etching method
- Patent number 6,251,542
- Issue date Jun 26, 2001
- Nippondenso Co., Ltd.
- Masahiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flat protective adhesive sheet and method...
- Patent number 6,245,593
- Issue date Jun 12, 2001
- Denso Corporation
- Shinji Yoshihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device employing silicon nitride layers with varied h...
- Patent number 6,137,156
- Issue date Oct 24, 2000
- DENSO Corporation
- Yuji Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer etching method
- Patent number 5,874,365
- Issue date Feb 23, 1999
- Nippondenso Co., Ltd.
- Masahiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming silicon nitride with varied hydrogen concentration
- Patent number 5,714,408
- Issue date Feb 3, 1998
- Denso Corporation
- Yuji Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor dynamic sensor and method of manufacturing the same
- Publication number 20070132045
- Publication date Jun 14, 2007
- DENSO CORPORATION
- Koichi Tsubaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for separating semiconductor substrate
- Publication number 20060040472
- Publication date Feb 23, 2006
- DENSO Corporation
- Muneo Tamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with flat protective adhesive sheet and method...
- Publication number 20010008300
- Publication date Jul 19, 2001
- IPICS Corporation
- Shinji Yoshihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Yasuo Souki

Person

Patents Grantslast 30 patents

Semiconductor dynamic sensor and method of manufacturing the same

Method for separating semiconductor substrate

Semiconductor device having a flat protective adhesive sheet

Semiconductor wafer etching method

Semiconductor device with flat protective adhesive sheet and method...

Semiconductor device employing silicon nitride layers with varied h...

Semiconductor wafer etching method

Method of forming silicon nitride with varied hydrogen concentration

Patents Applicationslast 30 patents

Semiconductor dynamic sensor and method of manufacturing the same

Method for separating semiconductor substrate

Semiconductor device with flat protective adhesive sheet and method...