Yasuo Tomioka

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Hitachi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper-alloy foil to be used for laminate sheet
- Patent number 6,767,643
- Issue date Jul 27, 2004
- Nippon Mining & Metals Co., Ltd.
- Hifumi Nagai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy foils
- Patent number 6,093,499
- Issue date Jul 25, 2000
- Nippon Mining & Metals Co., Ltd.
- Yasuo Tomioka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
COPPER, COPPER ALLOY, AND MANUFACTURING METHOD THEREFOR
- Publication number 20080277032
- Publication date Nov 13, 2008
- Nippon Mining & Metals Co., Ltd.
- Yasuo Tomioka
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Copper-alloy foil to be used for laminate sheet
- Publication number 20030044597
- Publication date Mar 6, 2003
- Hifumi Nagai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper, copper alloy, and manufacturing method therefor
- Publication number 20020189729
- Publication date Dec 19, 2002
- Nippon Mining & Metals Co., Ltd.
- Yasuo Tomioka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper-alloy foil to be used for laminate sheet
- Publication number 20020155021
- Publication date Oct 24, 2002
- Hifumi Nagai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...