Yasushi INOUE

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting diode element in which an optical semiconductor elem...
- Patent number 8,890,190
- Issue date Nov 18, 2014
- Nitto Denko Corporation
- Hisataka Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for producing semiconductor device and adhesiv...
- Patent number 8,659,157
- Issue date Feb 25, 2014
- Nitto Denko Corporation
- Yuta Kimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing light-emitting diode device
- Patent number 8,642,362
- Issue date Feb 4, 2014
- Nitto Denko Corporation
- Hisataka Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for producing semiconductor device
- Patent number 8,638,001
- Issue date Jan 28, 2014
- Nitto Denko Corporation
- Yuta Kimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board for mounting bare chip
- Patent number 6,462,282
- Issue date Oct 8, 2002
- Nitto Denko Corporation
- Yasushi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thermal expansion circuit board and multilayer wiring circuit b...
- Patent number 6,420,018
- Issue date Jul 16, 2002
- Nitto Denko Corporation
- Yasushi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided circuit board and multilayer wiring board comprising t...
- Patent number 6,373,000
- Issue date Apr 16, 2002
- Nitto Denko Corporation
- Kei Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring board and method for manufacturing the same
- Patent number 6,335,076
- Issue date Jan 1, 2002
- Nitto Denko Corporation
- Kei Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-scale package structure and circuit board attached thereto
- Patent number 6,333,469
- Issue date Dec 25, 2001
- Nitto Denko Corporation
- Yasushi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate and method for producing the same
- Patent number 6,328,201
- Issue date Dec 11, 2001
- Nitto Denko Corporation
- Yasushi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure of circuit board and multi-layer circuit board th...
- Patent number 6,310,391
- Issue date Oct 30, 2001
- Nitto Denko Corporation
- Megumu Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-thermal expansion circuit board and multilayer circuit board
- Patent number 6,258,449
- Issue date Jul 10, 2001
- Nitto Denko Corporation
- Megumu Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thermal expansion circuit board and multilayer wiring circuit b...
- Patent number 6,180,261
- Issue date Jan 30, 2001
- Nitto Denko Corporation
- Yasushi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate and method for producing the same
- Patent number 6,159,586
- Issue date Dec 12, 2000
- Nitto Denko Corporation
- Yasushi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible heat-sensitive recording material
- Patent number 5,902,768
- Issue date May 11, 1999
- Nitto Denko Corporation
- Yasushi Inoue
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Reversible heat-sensitive recording medium and magnetic card using...
- Patent number 5,573,996
- Issue date Nov 12, 1996
- Nitto Denko Corporation
- Yasushi Inoue
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Reversible heat-sensitive recording medium and magnetic card using...
- Patent number 5,472,929
- Issue date Dec 5, 1995
- Nitto Denko Corporation
- Yasushi Inoue
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Reversible heat-sensitive recording material and magnetic card usin...
- Patent number 5,258,350
- Issue date Nov 2, 1993
- Nitto Denko Corporation
- Yasushi Inoue
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Reversible heat-senitive recording material and magnetic card using...
- Patent number 5,229,350
- Issue date Jul 20, 1993
- Nitto Denko Corporation
- Takae Shinagawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE AND ADHESIV...
- Publication number 20120302042
- Publication date Nov 29, 2012
- Yuta KIMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20120295416
- Publication date Nov 22, 2012
- Yuta KIMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIGHT-EMITTING DIODE ELEMENT AND LIGHT-EMITTING DIODE DEVICE
- Publication number 20120217527
- Publication date Aug 30, 2012
- Nitto Denko Corporation
- Hisataka ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE
- Publication number 20120220059
- Publication date Aug 30, 2012
- Nitto Denko Corporation
- Hisataka ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTU...
- Publication number 20110189835
- Publication date Aug 4, 2011
- Yuki Sugo
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...
- Publication number 20110190421
- Publication date Aug 4, 2011
- Yuta KIMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Double-sided circuit board and multilayer wiring board comprising t...
- Publication number 20010004944
- Publication date Jun 28, 2001
- Kei Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yasushi INOUE

Person

Patents Grantslast 30 patents

Light-emitting diode element in which an optical semiconductor elem...

Adhesive composition for producing semiconductor device and adhesiv...

Method for producing light-emitting diode device

Adhesive sheet for producing semiconductor device

Circuit board for mounting bare chip

Low thermal expansion circuit board and multilayer wiring circuit b...

Double-sided circuit board and multilayer wiring board comprising t...

Multi-layer wiring board and method for manufacturing the same

Wafer-scale package structure and circuit board attached thereto

Multilayer wiring substrate and method for producing the same

Mounted structure of circuit board and multi-layer circuit board th...

Low-thermal expansion circuit board and multilayer circuit board

Low thermal expansion circuit board and multilayer wiring circuit b...

Multilayer wiring substrate and method for producing the same

Reversible heat-sensitive recording material

Reversible heat-sensitive recording medium and magnetic card using...

Reversible heat-sensitive recording medium and magnetic card using...

Reversible heat-sensitive recording material and magnetic card usin...

Reversible heat-senitive recording material and magnetic card using...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE AND ADHESIV...

ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE

LIGHT-EMITTING DIODE ELEMENT AND LIGHT-EMITTING DIODE DEVICE

METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE

FILM FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTU...

ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...

Double-sided circuit board and multilayer wiring board comprising t...