Yasushi ISHIZAKA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition, and method of bonding an adherend and method...
- Patent number 10,988,646
- Issue date Apr 27, 2021
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable and hygroscopic resin composition for sealing electronic de...
- Patent number 10,829,669
- Issue date Nov 10, 2020
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable and hygroscopic resin composition for sealing electronic de...
- Patent number 10,556,974
- Issue date Feb 11, 2020
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Resin composition for sealing electronic device, and electronic device
- Patent number 10,196,534
- Issue date Feb 5, 2019
- Furukawa Electric Co., Ltd.
- Takumi Asanuma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition for sealing electronic device, and electronic device
- Patent number 10,196,547
- Issue date Feb 5, 2019
- FURUKAWA ELECTRICS CO., LTD.
- Masami Aoyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Filler material for organic electroluminescent element and method o...
- Patent number 10,084,153
- Issue date Sep 25, 2018
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition for sealing electronic devices, and electronic de...
- Patent number 10,079,360
- Issue date Sep 18, 2018
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Filler material for organic electroluminescent element and method o...
- Patent number 9,793,511
- Issue date Oct 17, 2017
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, AND METHOD OF BONDING AN ADHEREND AND METHOD...
- Publication number 20180291242
- Publication date Oct 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...
- Publication number 20180208804
- Publication date Jul 26, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICES, AND ELECTRONIC DE...
- Publication number 20170331070
- Publication date Nov 16, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...
- Publication number 20170327608
- Publication date Nov 16, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
- Publication number 20160362576
- Publication date Dec 15, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Takumi ASANUMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
- Publication number 20160362587
- Publication date Dec 15, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Masami AOYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...
- Publication number 20160308164
- Publication date Oct 20, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...
- Publication number 20160308165
- Publication date Oct 20, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS

Yasushi ISHIZAKA

Person

Patents Grantslast 30 patents

Adhesive composition, and method of bonding an adherend and method...

Curable and hygroscopic resin composition for sealing electronic de...

Curable and hygroscopic resin composition for sealing electronic de...

Resin composition for sealing electronic device, and electronic device

Resin composition for sealing electronic device, and electronic device

Filler material for organic electroluminescent element and method o...

Resin composition for sealing electronic devices, and electronic de...

Filler material for organic electroluminescent element and method o...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION, AND METHOD OF BONDING AN ADHEREND AND METHOD...

CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...

RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICES, AND ELECTRONIC DE...

CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...

RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...

FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...