Yasushi KAMEDA

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Hayama Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer, semiconductor chip, and dicing method
- Patent number 11,545,402
- Issue date Jan 3, 2023
- Kioxia Corporation
- Hiromitsu Harashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including first pads on a first chip t...
- Patent number 11,482,514
- Issue date Oct 25, 2022
- Kioxia Corporation
- Hiromitsu Harashima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, AND DICING METHOD
- Publication number 20210375704
- Publication date Dec 2, 2021
- KIOXIA Corporation
- Hiromitsu HARASHIMA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210082896
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Hiromitsu HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS