Yasushi Kasatani

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bump formation method
- Patent number 6,861,370
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Yasushi Kasatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having an upper layer semiconductor package ov...
- Patent number 6,798,056
- Issue date Sep 28, 2004
- Renesas Technology Corp.
- Tetsuya Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 6,717,275
- Issue date Apr 6, 2004
- Renesas Technology Corp.
- Tetsuya Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and electronic component
- Patent number 6,670,701
- Issue date Dec 30, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor module using the same
- Patent number 6,617,695
- Issue date Sep 9, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yasushi Kasatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array semiconductor device
- Patent number 6,590,286
- Issue date Jul 8, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Makio Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 6,492,714
- Issue date Dec 10, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yasushi Kasatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory card
- Patent number 5,363,274
- Issue date Nov 8, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Makoto Omori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and terminal board with staggered conductive...
- Patent number 5,306,541
- Issue date Apr 26, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Yasushi Kasatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting electrode
- Patent number 5,024,605
- Issue date Jun 18, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Yasushi Kasatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC card including enclosed sliding shutter
- Patent number 4,868,714
- Issue date Sep 19, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Toshinobu Banjo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mechanism for connecting an IC card to an external device
- Patent number 4,864,116
- Issue date Sep 5, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Toshinobu Banjo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mechanism for connecting IC card and external device
- Patent number 4,838,804
- Issue date Jun 13, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Toshinobu Banjo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor module
- Publication number 20030174481
- Publication date Sep 18, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Matsuura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor module
- Publication number 20030080438
- Publication date May 1, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20030052393
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-mounting connector and semiconductor module using the same
- Publication number 20030051893
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tadashi Ichimasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array semiconductor device and method of mounting land gr...
- Publication number 20020153608
- Publication date Oct 24, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Makio Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and electronic component
- Publication number 20020100965
- Publication date Aug 1, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Yasushi Kasatani

Person

Patents Grantslast 30 patents

Bump formation method

Semiconductor module having an upper layer semiconductor package ov...

Semiconductor module

Semiconductor module and electronic component

Semiconductor device and semiconductor module using the same

Land grid array semiconductor device

Semiconductor device and semiconductor module

Memory card

Printed circuit board and terminal board with staggered conductive...

Connecting electrode

IC card including enclosed sliding shutter

Mechanism for connecting an IC card to an external device

Mechanism for connecting IC card and external device

Patents Applicationslast 30 patents

Semiconductor module

Semiconductor module

Semiconductor device

Surface-mounting connector and semiconductor module using the same

Land grid array semiconductor device and method of mounting land gr...

Semiconductor module and electronic component