Yasushi Mizusawa

Person

Yamanashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Film forming method using reversible decomposition reaction
- Patent number 9,976,217
- Issue date May 22, 2018
- Tokyo Electron Limited
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trap assembly in film forming apparatus
- Patent number 9,896,761
- Issue date Feb 20, 2018
- Tokyo Electron Limited
- Masamichi Hara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,576,850
- Issue date Feb 21, 2017
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for film formation, apparatus for film formation, and comput...
- Patent number 9,062,374
- Issue date Jun 23, 2015
- Tokyo Electron Limited
- Masamichi Hara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming Cu wiring
- Patent number 9,064,690
- Issue date Jun 23, 2015
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,999,841
- Issue date Apr 7, 2015
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mounting table structure, film forming apparatus and raw material r...
- Patent number 8,992,686
- Issue date Mar 31, 2015
- Tokyo Electron Limited
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming copper wiring and method and system for forming c...
- Patent number 8,859,422
- Issue date Oct 14, 2014
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming method and processing system
- Patent number 8,440,563
- Issue date May 14, 2013
- Tokyo Electron Limited
- Kenji Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Raw material recovery method and trapping mechanism for recovering...
- Patent number 8,408,025
- Issue date Apr 2, 2013
- Tokyo Electron Limited
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming copper wiring and copper film, and film forming...
- Patent number 8,399,353
- Issue date Mar 19, 2013
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion barrier for integrated circuits formed from a layer of re...
- Patent number 8,372,739
- Issue date Feb 12, 2013
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for film formation, apparatus for film formation, and comput...
- Patent number 8,273,409
- Issue date Sep 25, 2012
- Tokyo Electron Limited
- Masamichi Hara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for improving sidewall coverage in a deposition s...
- Patent number 7,935,393
- Issue date May 3, 2011
- Tokyo Electron Limited
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a ruthenium metal cap layer
- Patent number 7,799,681
- Issue date Sep 21, 2010
- Tokyo Electron Limited
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
TRAP ASSEMBLY IN FILM FORMING APPARATUS
- Publication number 20150136027
- Publication date May 21, 2015
- TOKYO ELECTRON LIMITED
- Masamichi HARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLACING TABLE STRUCTURE
- Publication number 20150044368
- Publication date Feb 12, 2015
- TOKYO ELECTRON LIMITED
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140377947
- Publication date Dec 25, 2014
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTER DEVICE
- Publication number 20140346037
- Publication date Nov 27, 2014
- Shigeru MIZUNO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20140287163
- Publication date Sep 25, 2014
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING CU WIRING
- Publication number 20140045329
- Publication date Feb 13, 2014
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING COPPER WIRING
- Publication number 20140030886
- Publication date Jan 30, 2014
- TOKYO ELECTRON LIMITED
- Takara FUKUSHIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20130237053
- Publication date Sep 12, 2013
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130203250
- Publication date Aug 8, 2013
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MAGNETRON SPUTTERING APPARATUS AND METHOD
- Publication number 20130081938
- Publication date Apr 4, 2013
- Shigeru MIZUNO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING Cu WIRING
- Publication number 20120222782
- Publication date Sep 6, 2012
- TOKYO ELECTRON LIMITED
- Atsushi Gomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20120196052
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...
- Publication number 20120196437
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING CVD-RU FILM AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20120064717
- Publication date Mar 15, 2012
- TOKYO ELECTRON LIMITED
- Takara KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOUNTING TABLE STRUCTURE, FILM FORMING APPARATUS AND RAW MATERIAL R...
- Publication number 20120055403
- Publication date Mar 8, 2012
- TOKYO ELECTRON LIMITED
- Atsushi GOMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM PROCESSING APPARATUS
- Publication number 20120014768
- Publication date Jan 19, 2012
- TOKYO ELECTRON LIMITED
- Tetsuya MIYASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Film Formation, Apparatus for Film Formation, and Comput...
- Publication number 20110300291
- Publication date Dec 8, 2011
- Masamichi Hara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLACING TABLE STRUCTURE
- Publication number 20110263123
- Publication date Oct 27, 2011
- TOKYO ELECTRON LIMITED
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RAW MATERIAL RECOVERY METHOD AND TRAPPING MECHANISM FOR RECOVERING...
- Publication number 20110203310
- Publication date Aug 25, 2011
- TOKYO ELECTRON LIMITED
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND PROCESSING SYSTEM
- Publication number 20110163451
- Publication date Jul 7, 2011
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FILM FORMATION, APPARATUS FOR FILM FORMATION, AND COMPUT...
- Publication number 20110092070
- Publication date Apr 21, 2011
- TOKYO ELECTRON LIMITED
- Masamichi Hara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING A RUTHENIUM METAL CAP LAYER
- Publication number 20100015798
- Publication date Jan 21, 2010
- TOKYO ELECTRON LIMITED
- Kenji Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING SIDEWALL COVERAGE IN A DEPOSITION S...
- Publication number 20090041950
- Publication date Feb 12, 2009
- TOKYO ELECTRON LIMITED
- SHIGERU MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR INTEGRATED CIRCUITS FORMED FROM A LAYER OF RE...
- Publication number 20080237859
- Publication date Oct 2, 2008
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS

Yasushi Mizusawa

Person

Patents Grantslast 30 patents

Film forming method using reversible decomposition reaction

Trap assembly in film forming apparatus

Method for manufacturing semiconductor device

Method for film formation, apparatus for film formation, and comput...

Method for forming Cu wiring

Semiconductor device manufacturing method

Mounting table structure, film forming apparatus and raw material r...

Method of forming copper wiring and method and system for forming c...

Film forming method and processing system

Raw material recovery method and trapping mechanism for recovering...

Methods of forming copper wiring and copper film, and film forming...

Diffusion barrier for integrated circuits formed from a layer of re...

Method for film formation, apparatus for film formation, and comput...

Method and system for improving sidewall coverage in a deposition s...

Method for forming a ruthenium metal cap layer

Patents Applicationslast 30 patents

TRAP ASSEMBLY IN FILM FORMING APPARATUS

PLACING TABLE STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SPUTTER DEVICE

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

METHOD FOR FORMING CU WIRING

METHOD FOR FORMING COPPER WIRING

FILM FORMING METHOD AND FILM FORMING APPARATUS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

MAGNETRON SPUTTERING APPARATUS AND METHOD

METHOD FOR FORMING Cu WIRING

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...

METHOD FOR FORMING CVD-RU FILM AND METHOD FOR MANUFACTURING SEMICON...

MOUNTING TABLE STRUCTURE, FILM FORMING APPARATUS AND RAW MATERIAL R...

VACUUM PROCESSING APPARATUS

Method for Film Formation, Apparatus for Film Formation, and Comput...

PLACING TABLE STRUCTURE

RAW MATERIAL RECOVERY METHOD AND TRAPPING MECHANISM FOR RECOVERING...

FILM FORMING METHOD AND PROCESSING SYSTEM

METHOD FOR FILM FORMATION, APPARATUS FOR FILM FORMATION, AND COMPUT...

METHOD FOR FORMING A RUTHENIUM METAL CAP LAYER

METHOD AND SYSTEM FOR IMPROVING SIDEWALL COVERAGE IN A DEPOSITION S...

DIFFUSION BARRIER FOR INTEGRATED CIRCUITS FORMED FROM A LAYER OF RE...