Yasushi OOKURA

Person

Okazaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,002,807
- Issue date Jun 19, 2018
- Denso Corporation
- Yasushi Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,691,713
- Issue date Jun 27, 2017
- Denso Corporation
- Shun Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,502,327
- Issue date Nov 22, 2016
- Denso Corporation
- Shun Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having both IGBT area and diode area
- Patent number 8,952,449
- Issue date Feb 10, 2015
- Toyota Jidosha Kabushiki Kaisha
- Masaki Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,716,746
- Issue date May 6, 2014
- Denso Corporation
- Masaki Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing the same
- Patent number 8,497,572
- Issue date Jul 30, 2013
- Denso Corporation
- Keita Fukutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including two heat sinks and method of manufac...
- Patent number 8,405,194
- Issue date Mar 26, 2013
- Denso Corporation
- Masayoshi Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer-molded power device and method for manufacturing transfer-...
- Patent number 7,145,254
- Issue date Dec 5, 2006
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230163054
- Publication date May 25, 2023
- DENSO CORPORATION
- Seigo OOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20230093554
- Publication date Mar 23, 2023
- DENSO CORPORATION
- SEIGO OOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230032353
- Publication date Feb 2, 2023
- DENSO CORPORATION
- TAKAHIRO NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160204047
- Publication date Jul 14, 2016
- Denso Corporation
- Shun SUGIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160163656
- Publication date Jun 9, 2016
- Denso Corporation
- Shun SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150221566
- Publication date Aug 6, 2015
- Denso Corporation
- Yasushi Ookura
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120043581
- Publication date Feb 23, 2012
- Masaki KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BOTH IGBT AREA AND DIODE AREA
- Publication number 20120043582
- Publication date Feb 23, 2012
- Toyota Jidosha Kabushiki Kaisha
- Masaki KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120001308
- Publication date Jan 5, 2012
- DENSO CORPORATION
- Keita Fukutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including two heat sinks and method of manufac...
- Publication number 20100327455
- Publication date Dec 30, 2010
- DENSO CORPORATION
- Masayoshi Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer-molded power device and method for manufacturing transfer-...
- Publication number 20030022464
- Publication date Jan 30, 2003
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS

Yasushi OOKURA

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device having both IGBT area and diode area

Semiconductor device

Semiconductor module and method of manufacturing the same

Semiconductor device including two heat sinks and method of manufac...

Transfer-molded power device and method for manufacturing transfer-...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING BOTH IGBT AREA AND DIODE AREA

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device including two heat sinks and method of manufac...

Transfer-molded power device and method for manufacturing transfer-...