Yasushi Shimada

Person

Tsukuba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition, process for producing the same, adhesive film...
- Patent number 8,119,737
- Issue date Feb 21, 2012
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device by adhering circuit substrate with adhesive fi...
- Patent number 7,947,779
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Insulation material, film, circuit board and method of producing them
- Patent number 7,700,185
- Issue date Apr 20, 2010
- Hitachi Chemical Company, Ltd.
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, manufacturing method thereof, semiconducto...
- Patent number 7,592,250
- Issue date Sep 22, 2009
- Hitachi Chemical Company, Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, method for producing the same, semiconduct...
- Patent number 7,239,013
- Issue date Jul 3, 2007
- Hitachi Chemical Co., Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, method for preparing the same, adhesive film...
- Patent number 7,070,670
- Issue date Jul 4, 2006
- Hitachi Chemical Co., Ltd.
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic circuit including multilayer cir...
- Patent number 6,889,431
- Issue date May 10, 2005
- Hitachi, Ltd.
- Hiroshi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive, adhesive member, interconnecting substrate for semiconduc...
- Patent number 6,838,170
- Issue date Jan 4, 2005
- Hitachi Chemical Company, Ltd.
- Yuko Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive, adhesive member, interconnecting substrate for semiconduc...
- Patent number 6,673,441
- Issue date Jan 6, 2004
- Hitachi Chemical Company, Ltd.
- Yuko Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device, substrate for mounting semiconductor chip, pr...
- Patent number 6,621,170
- Issue date Sep 16, 2003
- Hitachi Chemical Company, Ltd.
- Kazunori Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor chip mounting substrate, method...
- Patent number 6,265,782
- Issue date Jul 24, 2001
- Hitachi Chemical Co., Ltd.
- Kazunori Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic component parts device
- Patent number 6,184,577
- Issue date Feb 6, 2001
- Hitachi Chemical Company, Ltd.
- Kenzo Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board for mounting semiconductor device and metho...
- Patent number 6,090,468
- Issue date Jul 18, 2000
- Hitachi Chemical Company, Ltd.
- Yasushi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive, adhesive film and adhesive-backed metal foil
- Patent number 5,965,269
- Issue date Oct 12, 1999
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for producing coaxial conductor interconnection wiring board
- Patent number 5,323,534
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial conductor interconnection wiring board
- Patent number 5,233,133
- Issue date Aug 3, 1993
- Hitachi Chemical Company Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20140332984
- Publication date Nov 13, 2014
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20120080808
- Publication date Apr 5, 2012
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110187006
- Publication date Aug 4, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110021005
- Publication date Jan 27, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20090186955
- Publication date Jul 23, 2009
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multilayer wiring board, manufacturing method thereof, semiconducto...
- Publication number 20070108588
- Publication date May 17, 2007
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulation material, film, circuit board and method of producing them
- Publication number 20070060672
- Publication date Mar 15, 2007
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20070036971
- Publication date Feb 15, 2007
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060106166
- Publication date May 18, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060100315
- Publication date May 11, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multilayer wiring board, method for producing the same, semiconduct...
- Publication number 20060063367
- Publication date Mar 23, 2006
- HITACHI CHEMICAL CO., Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive composition, method for preparing the same, adhesive film...
- Publication number 20030159773
- Publication date Aug 28, 2003
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive, adhesive member, interconnecting substrate for semiconduc...
- Publication number 20030145949
- Publication date Aug 7, 2003
- Yuko Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Manufacturing method of electronic circuit including multilayer cir...
- Publication number 20030097750
- Publication date May 29, 2003
- Hitachi, Ltd.
- Hiroshi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive composition , process for producing the same, adhesive fil...
- Publication number 20030069331
- Publication date Apr 10, 2003
- Inada Teiichi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor device, substrate for mounting semiconductor chip, pr...
- Publication number 20010022404
- Publication date Sep 20, 2001
- Hitachi Chemical Company Ltd.
- Kazunori Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Yasushi Shimada

Person

Patents Grantslast 30 patents

Adhesive composition, process for producing the same, adhesive film...

Semiconductor device by adhering circuit substrate with adhesive fi...

Insulation material, film, circuit board and method of producing them

Multilayer wiring board, manufacturing method thereof, semiconducto...

Multilayer wiring board, method for producing the same, semiconduct...

Adhesive composition, method for preparing the same, adhesive film...

Manufacturing method of electronic circuit including multilayer cir...

Adhesive, adhesive member, interconnecting substrate for semiconduc...

Adhesive, adhesive member, interconnecting substrate for semiconduc...

Semiconductor device, substrate for mounting semiconductor chip, pr...

Semiconductor device, semiconductor chip mounting substrate, method...

Electronic component parts device

Multilayer wiring board for mounting semiconductor device and metho...

Adhesive, adhesive film and adhesive-backed metal foil

Process for producing coaxial conductor interconnection wiring board

Coaxial conductor interconnection wiring board

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

Multilayer wiring board, manufacturing method thereof, semiconducto...

Insulation material, film, circuit board and method of producing them

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, process for producing the same, adhesive film...

Multilayer wiring board, method for producing the same, semiconduct...

Adhesive composition, method for preparing the same, adhesive film...

Adhesive, adhesive member, interconnecting substrate for semiconduc...

Manufacturing method of electronic circuit including multilayer cir...

Adhesive composition , process for producing the same, adhesive fil...

Semiconductor device, substrate for mounting semiconductor chip, pr...