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Kanagawa, JP
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last 30 patents
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Patent Grant
Auatomatic inspection system for IC lead frames and visual inspecti...
Patent number
4,851,902
Issue date
Jul 25, 1989
Electroplating Engineers of Japan, Limited
Junichi Tezuka
B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information
Patent Grant
Plating device for minute portions of connector terminals
Patent number
4,702,811
Issue date
Oct 27, 1987
Electroplating Engineers of Japan, Limited
Yasuto Murata
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Partial plating device
Patent number
4,683,045
Issue date
Jul 28, 1987
Electroplating Engineers of Japan, Limited
Yasuto Murata
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Brush plating method for connector terminals
Patent number
4,655,881
Issue date
Apr 7, 1987
Electroplating Engineers of Japan, Limited
Junichi Tezuka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR