Yasuto Onitsuka

Person

Fukuoka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of mounting electronic parts on a flexible printed circuit b...
- Patent number 7,107,672
- Issue date Sep 19, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method
- Patent number 6,869,491
- Issue date Mar 22, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling electronic applications and display devices
- Patent number 6,618,937
- Issue date Sep 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding machine of electronic components and bonding method thereof
- Patent number 5,839,645
- Issue date Nov 24, 1998
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method of devices
- Patent number 5,628,660
- Issue date May 13, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus for electronic components
- Patent number 5,591,295
- Issue date Jan 7, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus
- Patent number 5,513,792
- Issue date May 7, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outer-lead bonding apparatus and method therefor
- Patent number 5,501,004
- Issue date Mar 26, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device of electronic components and a mounting method
- Patent number 5,501,005
- Issue date Mar 26, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ACF ATTACHMENT DEVICE AND ACF ATTACHMENT METHOD
- Publication number 20090193650
- Publication date Aug 6, 2009
- Yasuto Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method
- Publication number 20040129364
- Publication date Jul 8, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yasuto Onitsuka
- G02 - OPTICS
Information Patent Application
Transfer carrier for flexible printed circuit board and electronic...
- Publication number 20040027811
- Publication date Feb 12, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yasuto Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly apparatus and assembly method of electronic appliances and...
- Publication number 20020004980
- Publication date Jan 17, 2002
- Yasuto Onitsuka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Yasuto Onitsuka

Person

Patents Grantslast 30 patents

Method of mounting electronic parts on a flexible printed circuit b...

Bonding method

Method of assembling electronic applications and display devices

Bonding machine of electronic components and bonding method thereof

Bonding apparatus and bonding method of devices

Bonding apparatus for electronic components

Bonding apparatus

Outer-lead bonding apparatus and method therefor

Mounting device of electronic components and a mounting method

Patents Applicationslast 30 patents

ACF ATTACHMENT DEVICE AND ACF ATTACHMENT METHOD

Bonding method

Transfer carrier for flexible printed circuit board and electronic...

Assembly apparatus and assembly method of electronic appliances and...