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Yasutomi Asai
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Okazaki-city, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device
Patent number
10,002,841
Issue date
Jun 19, 2018
Denso Corporation
Shotaro Miyawaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with resin mold
Patent number
9,087,924
Issue date
Jul 21, 2015
Denso Corporation
Tetsuto Yamagishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with resin mold
Patent number
8,749,055
Issue date
Jun 10, 2014
Denso Corporation
Tetsuto Yamagishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including double-sided multi-electrode chip em...
Patent number
8,446,003
Issue date
May 21, 2013
Denso Corporation
Atsushi Komura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing semiconductor device including semiconduct...
Patent number
8,309,434
Issue date
Nov 13, 2012
Denso Corporation
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with resin mold
Patent number
8,207,607
Issue date
Jun 26, 2012
Denso Corporation
Tetsuto Yamagishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical device having metal pad bonded with metal wiring and man...
Patent number
6,645,606
Issue date
Nov 11, 2003
Denso Corporation
Tetsuo Nakano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounting structure of semiconductor element
Patent number
6,376,906
Issue date
Apr 23, 2002
Denso Corporation
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting structure of electronic parts and mounting method of elect...
Patent number
6,326,239
Issue date
Dec 4, 2001
Denso Corporation
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer circuit board having no local warp on mounting surface t...
Patent number
6,217,990
Issue date
Apr 17, 2001
Denso Corporation
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing ceramic laminated substrate
Patent number
6,048,424
Issue date
Apr 11, 2000
Denso Corporation
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layered substrate
Patent number
5,731,067
Issue date
Mar 24, 1998
Denso Corporation
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20170256510
Publication date
Sep 7, 2017
Shotaro MIYAWAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20140217620
Publication date
Aug 7, 2014
DENSO CORPORATION
Tetsuto Yamagishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20120223444
Publication date
Sep 6, 2012
DENSO CORPORATION
Tetsuto Yamagishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method for manufacturing the same
Publication number
20110033975
Publication date
Feb 10, 2011
DENSO CORPORATION
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20100295170
Publication date
Nov 25, 2010
DENSO CORPORATION
Atsushi KOMURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device and method for manufacturing the same
Publication number
20090152714
Publication date
Jun 18, 2009
DENSO CORPORATION
Tetsuto Yamagishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method for manufacturing the same
Publication number
20070278550
Publication date
Dec 6, 2007
DENSO CORPORATION
Yasutomi Asai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having metallic lead and electronic device hav...
Publication number
20070075419
Publication date
Apr 5, 2007
DENSO CORPORATION
Yutaka Fukuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical device having metal pad bonded with metal wiring and man...
Publication number
20020187319
Publication date
Dec 12, 2002
Tetsuo Nakano
H01 - BASIC ELECTRIC ELEMENTS