Yasutomo SUGA

Person

Takasaki-Shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic electronic component and substrate arrangement
- Patent number 11,996,243
- Issue date May 28, 2024
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component, substrate arrangement and method of m...
- Patent number 11,990,283
- Issue date May 21, 2024
- Taiyo Yuden Co., Ltd.
- Yoshiyuki Motomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device and mounting substrate
- Patent number 11,763,993
- Issue date Sep 19, 2023
- Taiyo Yuden Co., Ltd.
- Kimio Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component
- Patent number 11,557,439
- Issue date Jan 17, 2023
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 11,201,014
- Issue date Dec 14, 2021
- Taiyo Yuden Co., Ltd.
- Jun Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and mounting board
- Patent number 11,037,731
- Issue date Jun 15, 2021
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component having external electrode...
- Patent number 11,024,461
- Issue date Jun 1, 2021
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component
- Patent number 11,017,952
- Issue date May 25, 2021
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated ceramic electronic component
- Patent number 10,541,086
- Issue date Jan 21, 2020
- Taiyo Yuden Co., Ltd.
- Yoshiaki Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and method of producing the same
- Patent number 10,497,513
- Issue date Dec 3, 2019
- Taiyo Yuden Co., Ltd.
- Yuji Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component
- Patent number 10,395,830
- Issue date Aug 27, 2019
- Taiyo Yuden Co., Ltd.
- Masataka Watabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component
- Patent number 10,354,801
- Issue date Jul 16, 2019
- Taiyo Yuden Co., Ltd.
- Masataka Watabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method of housing an electronic co...
- Patent number 10,319,658
- Issue date Jun 11, 2019
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-height multilayer ceramic capacitor
- Patent number 9,502,181
- Issue date Nov 22, 2016
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD...
- Publication number 20230335340
- Publication date Oct 19, 2023
- Taiyo Yuden Co., Ltd.
- Yuji TOMIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT AND SUBSTRATE ARRANGEMENT
- Publication number 20220344098
- Publication date Oct 27, 2022
- Taiyo Yuden Co., Ltd.
- Yasutomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT, SUBSTRATE ARRANGEMENT, AND METHOD OF...
- Publication number 20220301778
- Publication date Sep 22, 2022
- Taiyo Yuden Co., Ltd.
- Yasutomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND COMPONENT MOUNTING SUBSTRATE
- Publication number 20220262572
- Publication date Aug 18, 2022
- Taiyo Yuden Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT, SUBSTRATE ARRANGEMENT AND METHOD OF M...
- Publication number 20220181088
- Publication date Jun 9, 2022
- Taiyo Yuden Co., Ltd.
- Yoshiyuki MOTOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20210280375
- Publication date Sep 9, 2021
- Taiyo Yuden Co., Ltd.
- YASUTOMO SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC DEVICE AND MOUNTING SUBSTRATE
- Publication number 20210202173
- Publication date Jul 1, 2021
- Taiyo Yuden Co., Ltd.
- Kimio FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND COMPONENT MOUNTING SUBSTRATE
- Publication number 20210035743
- Publication date Feb 4, 2021
- Taiyo Yuden Co., Ltd.
- Tomoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
- Publication number 20200194184
- Publication date Jun 18, 2020
- Taiyo Yuden Co., Ltd.
- Jun NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD
- Publication number 20200168398
- Publication date May 28, 2020
- Taiyo Yuden Co., Ltd.
- Yasutomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20200082985
- Publication date Mar 12, 2020
- Taiyo Yuden Co., Ltd.
- Yasutomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20200027662
- Publication date Jan 23, 2020
- Taiyo Yuden Co., Ltd.
- YASUTOMO SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Ceramic Electronic Component
- Publication number 20180218840
- Publication date Aug 2, 2018
- Taiyo Yuden Co., Ltd.
- Masataka Watabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Package and Method of Housing an Electronic Co...
- Publication number 20180218958
- Publication date Aug 2, 2018
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Ceramic Electronic Component
- Publication number 20180218839
- Publication date Aug 2, 2018
- Taiyo Yuden Co., Ltd.
- Masataka Watabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Electronic Component and Method of Producing the Same
- Publication number 20170047163
- Publication date Feb 16, 2017
- Taiyo Yuden Co., Ltd.
- Yuji Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED CERAMIC ELECTRONIC COMPONENT
- Publication number 20160233027
- Publication date Aug 11, 2016
- Taiyo Yuden Co., Ltd.
- Yoshiaki IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-HEIGHT MULTILAYER CERAMIC CAPACITOR
- Publication number 20140285947
- Publication date Sep 25, 2014
- Taiyo Yuden Co., Ltd.
- Yasutomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS

Yasutomo SUGA

Person

Patents Grantslast 30 patents

Ceramic electronic component and substrate arrangement

Ceramic electronic component, substrate arrangement and method of m...

Ceramic electronic device and mounting substrate

Multi-layer ceramic electronic component

Multi-layer ceramic electronic component and circuit board

Multi-layer ceramic electronic component and mounting board

Multi-layer ceramic electronic component having external electrode...

Multi-layer ceramic electronic component

Laminated ceramic electronic component

Ceramic electronic component and method of producing the same

Multi-layer ceramic electronic component

Multi-layer ceramic electronic component

Electronic component package and method of housing an electronic co...

Low-height multilayer ceramic capacitor

Patents Applicationslast 30 patents

MULTILAYER CERAMIC ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD...

CERAMIC ELECTRONIC COMPONENT AND SUBSTRATE ARRANGEMENT

CERAMIC ELECTRONIC COMPONENT, SUBSTRATE ARRANGEMENT, AND METHOD OF...

MULTILAYER CERAMIC ELECTRONIC DEVICE AND COMPONENT MOUNTING SUBSTRATE

CERAMIC ELECTRONIC COMPONENT, SUBSTRATE ARRANGEMENT AND METHOD OF M...

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT

CERAMIC ELECTRONIC DEVICE AND MOUNTING SUBSTRATE

MULTILAYER CERAMIC ELECTRONIC DEVICE AND COMPONENT MOUNTING SUBSTRATE

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT

Multi-Layer Ceramic Electronic Component

Electronic Component Package and Method of Housing an Electronic Co...

Multi-Layer Ceramic Electronic Component

Ceramic Electronic Component and Method of Producing the Same

LAMINATED CERAMIC ELECTRONIC COMPONENT

LOW-HEIGHT MULTILAYER CERAMIC CAPACITOR