Yasutsugu Soeta

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 7,776,719
- Issue date Aug 17, 2010
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus, method for providing and mounting a polishing...
- Patent number 7,677,957
- Issue date Mar 16, 2010
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, method for processing polishing pad, and method for...
- Patent number 7,591,713
- Issue date Sep 22, 2009
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing bonded wafer
- Publication number 20090170285
- Publication date Jul 2, 2009
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method of SOI Wafer and SOI Wafer Manufactured by Thi...
- Publication number 20090117706
- Publication date May 7, 2009
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing pad, method for processing polishing pad and method for p...
- Publication number 20080139094
- Publication date Jun 12, 2008
- SHIN-ETSU HANDOTAI CO., LTD.
- Yasutsugu Soeta
- B24 - GRINDING POLISHING
Information Patent Application
Polishing cloth, polishing cloth processing method, and substrate m...
- Publication number 20070032175
- Publication date Feb 8, 2007
- SHIN-ETSU HANDOTAI CO., LTD.
- Yasutsugu Soeta
- B24 - GRINDING POLISHING