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Yasutsugu Tsutsumi

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  • Fukuoka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of plastic molding
    • Patent number 6,224,810
    • Issue date May 1, 2001
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Plastic molding method for semiconductor devices
    • Patent number 5,662,848
    • Issue date Sep 2, 1997
    • Mitsubishi Denki Kabushiki Kaisha
    • Sueyoshi Tanaka
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Apparatus for plastic encapsulation of a semiconductor element
    • Patent number 5,375,989
    • Issue date Dec 27, 1994
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Plastic molding apparatus
    • Patent number 5,366,364
    • Issue date Nov 22, 1994
    • Mitsubishi Denki Kabushiki Kaisha
    • Sueyoshi Tanaka
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Method for molding a semiconductor package on a continuous leadframe
    • Patent number 5,336,272
    • Issue date Aug 9, 1994
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Resin sealing apparatus
    • Patent number 5,281,121
    • Issue date Jan 25, 1994
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Long size lead frame for semiconductor elements
    • Patent number 5,134,458
    • Issue date Jul 28, 1992
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Resin sealing apparatus
    • Patent number 5,108,278
    • Issue date Apr 28, 1992
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Mold for resin-sealing a semiconductor device
    • Patent number 5,074,779
    • Issue date Dec 24, 1991
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Method of resin sealing semiconductor devices
    • Patent number 5,059,379
    • Issue date Oct 22, 1991
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Device for resin sealing semiconductor devices
    • Patent number 4,983,111
    • Issue date Jan 8, 1991
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Device for resin sealing semiconductor devices
    • Patent number 4,915,608
    • Issue date Apr 10, 1990
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL