Yasuyoshi Horikawa

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Inductor and method of manufacturing same
- Patent number 11,437,174
- Issue date Sep 6, 2022
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor
- Patent number 10,395,810
- Issue date Aug 27, 2019
- Shinko Electric Industries Co., Ltd.
- Atsushi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor
- Patent number 10,115,878
- Issue date Oct 30, 2018
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an inductor
- Patent number 10,062,490
- Issue date Aug 28, 2018
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor device and method of manufacturing the same
- Patent number 9,721,884
- Issue date Aug 1, 2017
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, manufacturing method therefor, and semiconductor...
- Patent number 9,603,253
- Issue date Mar 21, 2017
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and light emitting device
- Patent number 9,590,154
- Issue date Mar 7, 2017
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,324,929
- Issue date Apr 26, 2016
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,282,629
- Issue date Mar 8, 2016
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,159,648
- Issue date Oct 13, 2015
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, light emitting device, and manufacturing method o...
- Patent number 9,084,372
- Issue date Jul 14, 2015
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- F21 - LIGHTING
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,006,894
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting terminal structure, manufacturing method of the same and...
- Patent number 8,770,987
- Issue date Jul 8, 2014
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Connecting terminal structure, manufacturing method of the same and...
- Patent number 8,708,713
- Issue date Apr 29, 2014
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
Information Patent Grant
Connecting terminal structure, socket and electronic package
- Patent number 8,708,711
- Issue date Apr 29, 2014
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket and method of fabricating the same
- Patent number 8,419,442
- Issue date Apr 16, 2013
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated electronic part packaging structure
- Patent number 7,414,309
- Issue date Aug 19, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device substrate, semiconductor device, and manufactu...
- Patent number 7,402,900
- Issue date Jul 22, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device substrate, semiconductor device, and manufactu...
- Patent number 7,358,114
- Issue date Apr 15, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor device and semiconductor device having the same, and capa...
- Patent number 7,358,591
- Issue date Apr 15, 2008
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic parts packaging structure
- Patent number 7,319,049
- Issue date Jan 15, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 7,276,438
- Issue date Oct 2, 2007
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic part packaging structure
- Patent number 7,229,856
- Issue date Jun 12, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and manufacturing method thereof, semiconductor device an...
- Patent number 7,223,652
- Issue date May 29, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor device and method of manufacturing the same
- Patent number 7,072,168
- Issue date Jul 4, 2006
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor and method of producing same
- Patent number 7,038,904
- Issue date May 2, 2006
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for carrying a semiconductor chip and a manufacturing met...
- Patent number 6,998,308
- Issue date Feb 14, 2006
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor and manufacturing method thereof, semiconductor device an...
- Patent number 6,897,544
- Issue date May 24, 2005
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a wiring board
- Patent number 6,783,652
- Issue date Aug 31, 2004
- Shinko Electric Industries Co., Ltd.
- Takahiro Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INDUCTOR AND METHOD OF MANUFACTURING SAME
- Publication number 20180330861
- Publication date Nov 15, 2018
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR
- Publication number 20170358723
- Publication date Dec 14, 2017
- Shinko Electric Industries Co., LTD.
- Yasuyoshi Horikawa
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170117219
- Publication date Apr 27, 2017
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD OF MANUFACTURING SAME
- Publication number 20160343489
- Publication date Nov 24, 2016
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductor
- Publication number 20160343499
- Publication date Nov 24, 2016
- Shinko Electric Industries Co., Ltd.
- Atsushi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20150311417
- Publication date Oct 29, 2015
- Shinko Electric Industries Co., LTD.
- Yasuyoshi HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20150230328
- Publication date Aug 13, 2015
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi HORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...
- Publication number 20150201485
- Publication date Jul 16, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki DENDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Light Emitting Device
- Publication number 20150060920
- Publication date Mar 5, 2015
- Shinko Electric Industries Co., LTD.
- Yasuyoshi Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140264417
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140015121
- Publication date Jan 16, 2014
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD O...
- Publication number 20130188361
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Shigetsugu MURAMATSU
- F21 - LIGHTING
Information Patent Application
CONNECTING TERMINAL STRUCTURE, SOCKET AND ELECTRONIC PACKAGE
- Publication number 20120258636
- Publication date Oct 11, 2012
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi HORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING TERMINAL STRUCTURE, MANUFACTURING METHOD OF THE SAME AND...
- Publication number 20120108108
- Publication date May 3, 2012
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET AND METHOD OF FABRICATING THE SAME
- Publication number 20120021625
- Publication date Jan 26, 2012
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting substrate, manufacturing method of mounting substrate and...
- Publication number 20070119616
- Publication date May 31, 2007
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts and method of manufacturing electronic parts packa...
- Publication number 20070052086
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR...
- Publication number 20070040238
- Publication date Feb 22, 2007
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device substrate, semiconductor device, and manufactu...
- Publication number 20060040424
- Publication date Feb 23, 2006
- Kiyoshi Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part-containing elements, electronic devices and product...
- Publication number 20060017133
- Publication date Jan 26, 2006
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wiring substrate
- Publication number 20050277282
- Publication date Dec 15, 2005
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate, semiconductor device, and substrate fabricating method
- Publication number 20050258509
- Publication date Nov 24, 2005
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts and method of manufacturing electronic parts packa...
- Publication number 20050258447
- Publication date Nov 24, 2005
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an electronic parts packaging structure
- Publication number 20050247665
- Publication date Nov 10, 2005
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor device and semiconductor device having the same, and capa...
- Publication number 20050199929
- Publication date Sep 15, 2005
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate for carrying a semiconductor chip and a manufacturing met...
- Publication number 20050185382
- Publication date Aug 25, 2005
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor and manufacturing method thereof, semiconductor device an...
- Publication number 20050130368
- Publication date Jun 16, 2005
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor and method of producing same
- Publication number 20050088800
- Publication date Apr 28, 2005
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor device and method of manufacturing the same
- Publication number 20050013088
- Publication date Jan 20, 2005
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate manufacturing method
- Publication number 20040265482
- Publication date Dec 30, 2004
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yasuyoshi Horikawa

Person

Patents Grantslast 30 patents

Inductor and method of manufacturing same

Inductor

Optical sensor

Method of manufacturing an inductor

Inductor device and method of manufacturing the same

Wiring substrate, manufacturing method therefor, and semiconductor...

Wiring substrate and light emitting device

Wiring substrate

Wiring substrate and semiconductor package

Wiring substrate and manufacturing method thereof

Wiring substrate, light emitting device, and manufacturing method o...

Wiring board and light emitting device

Connecting terminal structure, manufacturing method of the same and...

Connecting terminal structure, manufacturing method of the same and...

Connecting terminal structure, socket and electronic package

Socket and method of fabricating the same

Encapsulated electronic part packaging structure

Semiconductor device substrate, semiconductor device, and manufactu...

Semiconductor device substrate, semiconductor device, and manufactu...

Capacitor device and semiconductor device having the same, and capa...

Method of manufacturing an electronic parts packaging structure

Method of manufacturing wiring substrate

Method of manufacturing electronic part packaging structure

Capacitor and manufacturing method thereof, semiconductor device an...

Capacitor device and method of manufacturing the same

Capacitor and method of producing same

Substrate for carrying a semiconductor chip and a manufacturing met...

Capacitor and manufacturing method thereof, semiconductor device an...

Process for manufacturing a wiring board

Patents Applicationslast 30 patents

INDUCTOR AND METHOD OF MANUFACTURING SAME

OPTICAL SENSOR

INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INDUCTOR AND METHOD OF MANUFACTURING SAME

Inductor

WIRING SUBSTRATE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...

Wiring Substrate and Light Emitting Device

WIRING BOARD AND LIGHT EMITTING DEVICE

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD O...

CONNECTING TERMINAL STRUCTURE, SOCKET AND ELECTRONIC PACKAGE

CONNECTING TERMINAL STRUCTURE, MANUFACTURING METHOD OF THE SAME AND...

SOCKET AND METHOD OF FABRICATING THE SAME

Mounting substrate, manufacturing method of mounting substrate and...

Electronic parts and method of manufacturing electronic parts packa...

COIL STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR...

Semiconductor device substrate, semiconductor device, and manufactu...

Electronic part-containing elements, electronic devices and product...

Method of manufacturing wiring substrate

Substrate, semiconductor device, and substrate fabricating method

Electronic parts and method of manufacturing electronic parts packa...

Method of manufacturing an electronic parts packaging structure

Capacitor device and semiconductor device having the same, and capa...

Substrate for carrying a semiconductor chip and a manufacturing met...

Capacitor and manufacturing method thereof, semiconductor device an...

Capacitor and method of producing same

Capacitor device and method of manufacturing the same

Wiring substrate manufacturing method