Yasuyuki Higuchi

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding structure for a semiconductor device
- Patent number 5,666,009
- Issue date Sep 9, 1997
- Rohm Co. Ltd.
- Hiroshi Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device with a doped polysilico...
- Patent number 5,407,857
- Issue date Apr 18, 1995
- Rohm Co., Ltd.
- Yasuyuki Higuchi
- H01 - BASIC ELECTRIC ELEMENTS