Yasuyuki Ito

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Tsuchiura, JP

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Patents Grantslast 30 patents

Information Patent Grant
Rolled copper foil
- Patent number 8,221,897
- Issue date Jul 17, 2012
- Hitachi Cable, Ltd.
- Takemi Muroga
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Nickel plating solution and its preparation method, nickel plating...
- Patent number 7,842,397
- Issue date Nov 30, 2010
- Hitachi Cable, Ltd.
- Yasuyuki Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rolled copper foil and manufacturing method thereof
- Patent number 7,789,977
- Issue date Sep 7, 2010
- Hitachi Cable, Ltd.
- Takemi Muroga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper foil for printed circuit board, method for fabricating same,...
- Patent number 7,344,785
- Issue date Mar 18, 2008
- Hitachi Cable, Ltd.
- Muneo Kodaira
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed circuit board with taking environmental con...
- Patent number 7,108,923
- Issue date Sep 19, 2006
- Hitachi Cable, Ltd.
- Yasuyuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
ROLLED COPPER FOIL AND MANUFACTURING METHOD THEREOF
- Publication number 20100291402
- Publication date Nov 18, 2010
- Takemi Muroga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ROLLED COPPER FOIL
- Publication number 20090017325
- Publication date Jan 15, 2009
- HITACHI CABLE, LTD.
- Takemi Muroga
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
ROLLED COPPER FOIL AND MANUFACTURING METHOD THEREOF
- Publication number 20080099110
- Publication date May 1, 2008
- Takemi Muroga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Nickel plating solution and its preparation method, nickel plating...
- Publication number 20070071999
- Publication date Mar 29, 2007
- Hitachi Cable, Ltd.
- Yasuyuki Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for printed circuit board, method for fabricating same,...
- Publication number 20060257680
- Publication date Nov 16, 2006
- HITACHI CABLE, LTD.
- Muneo Kodaira
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR