Yasuyuki NAKAJIMA

Person

Tachikawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, semiconductor wafer and manufacturing method...
- Patent number 8,378,459
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Yasuhiro Naka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,015,127
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with alternate bonding wire arrangement
- Patent number 6,900,551
- Issue date May 31, 2005
- Renesas Technology Corp.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 6,897,570
- Issue date May 24, 2005
- Renesas Technology, Corporation
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD...
- Publication number 20100308442
- Publication date Dec 9, 2010
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro NAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070187823
- Publication date Aug 16, 2007
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20050121805
- Publication date Jun 9, 2005
- Renesas Technology Corp. Hitachi ULSI Systems Co., Ltd.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050001314
- Publication date Jan 6, 2005
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040142551
- Publication date Jul 22, 2004
- Hitachi, Ltd.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20030230809
- Publication date Dec 18, 2003
- Hitachi, Ltd
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030218245
- Publication date Nov 27, 2003
- Hitachi, Ltd.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030168740
- Publication date Sep 11, 2003
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Yasuyuki NAKAJIMA

Person

Patents Grantslast 30 patents

Semiconductor device, semiconductor wafer and manufacturing method...

Semiconductor device and a method of manufacturing the same

Semiconductor device with alternate bonding wire arrangement

Semiconductor device and method of manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD...

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of manufacturing same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same