Yasuyuki SANDA

Person

Chiyoda-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor module with a highest portio...
- Patent number 11,322,430
- Issue date May 3, 2022
- Mitsubishi Electric Corporation
- Hodaka Rokubuichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,152,280
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Yasuyuki Sanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,107,745
- Issue date Aug 31, 2021
- Mitsubishi Electric Corporation
- Yasuyuki Sanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,049,787
- Issue date Jun 29, 2021
- Mitsubishi Electric Corporation
- Haruna Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductivity measurement device and thermal conductivity me...
- Patent number 10,775,329
- Issue date Sep 15, 2020
- Mitsubishi Electric Corporation
- Haruna Tada
- G01 - MEASURING TESTING
Information Patent Grant
Thermal conductivity measurement apparatus and thermal conductivity...
- Patent number 10,768,127
- Issue date Sep 8, 2020
- Mitsubishi Electric Corporation
- Yasuyuki Sanda
- G01 - MEASURING TESTING
Information Patent Grant
Swaged heat sink and heat sink integrated power module
- Patent number 9,892,992
- Issue date Feb 13, 2018
- Mitsubishi Electric Corporation
- Yasuyuki Sanda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Device, Method for Manufacturing Same, and Powe...
- Publication number 20240274489
- Publication date Aug 15, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Haruna TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20240222233
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Hodaka ROKUBUICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method of Manufacturing the Same, an...
- Publication number 20240074122
- Publication date Feb 29, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Yasuyuki SANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME, AND POWER...
- Publication number 20230275035
- Publication date Aug 31, 2023
- MITSUBISHI ELECTRIC CORPORATION
- Hiroyuki YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20200176361
- Publication date Jun 4, 2020
- Mitsubishi Electric Corporation
- Hodaka ROKUBUICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20200043824
- Publication date Feb 6, 2020
- Mitsubishi Electric Corporation
- Haruna TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVITY MEASUREMENT DEVICE AND THERMAL CONDUCTIVITY ME...
- Publication number 20190369038
- Publication date Dec 5, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Haruna Tada
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method for Manufacturing the Same
- Publication number 20190295919
- Publication date Sep 26, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yasuyuki Sanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVITY MEASUREMENT APPARATUS AND THERMAL CONDUCTIVITY...
- Publication number 20180299391
- Publication date Oct 18, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Yasuyuki SANDA
- G01 - MEASURING TESTING
Information Patent Application
SWAGED HEAT SINK AND HEAT SINK INTEGRATED POWER MODULE
- Publication number 20160225691
- Publication date Aug 4, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Yasuyuki SANDA
- H01 - BASIC ELECTRIC ELEMENTS

Yasuyuki SANDA

Person

Patents Grantslast 30 patents

Semiconductor device and semiconductor module with a highest portio...

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Thermal conductivity measurement device and thermal conductivity me...

Thermal conductivity measurement apparatus and thermal conductivity...

Swaged heat sink and heat sink integrated power module

Patents Applicationslast 30 patents

Power Semiconductor Device, Method for Manufacturing Same, and Powe...

SEMICONDUCTOR DEVICE AND POWER CONVERTER

Power Semiconductor Device and Method of Manufacturing the Same, an...

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME, AND POWER...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

Semiconductor Device and Method of Manufacturing the Same

THERMAL CONDUCTIVITY MEASUREMENT DEVICE AND THERMAL CONDUCTIVITY ME...

Semiconductor Device and Method for Manufacturing the Same

THERMAL CONDUCTIVITY MEASUREMENT APPARATUS AND THERMAL CONDUCTIVITY...

SWAGED HEAT SINK AND HEAT SINK INTEGRATED POWER MODULE