Yasuyuki Yamada

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dimming laminate and resin spacer for dimming laminate
- Patent number 12,072,583
- Issue date Aug 27, 2024
- Sekisui Chemical Co., Ltd.
- Yasuyuki Yamada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dimming laminate and resin spacer for dimming laminate
- Patent number 11,644,717
- Issue date May 9, 2023
- Sekisui Chemical Co., Ltd.
- Yasuyuki Yamada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,027,374
- Issue date Jun 8, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connecting material and connection structure
- Patent number 11,020,825
- Issue date Jun 1, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,024,439
- Issue date Jun 1, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,017,916
- Issue date May 25, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Composition for bonding, optical adhesive, and adhesive for pressur...
- Patent number 10,961,420
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor sensor chip mounting, and semiconductor...
- Patent number 10,790,217
- Issue date Sep 29, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor mounting, and semiconductor sensor
- Patent number 10,679,925
- Issue date Jun 9, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing single-hole hollow polymer microparticles
- Patent number 8,470,398
- Issue date Jun 25, 2013
- Sekisui Chemical Co., Ltd.
- Hiroshi Yamauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for producing single-hole hollow polymer particles
- Patent number 8,465,836
- Issue date Jun 18, 2013
- Sekisui Chemical Co., Ltd.
- Hiroshi Yamauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
DIMMING LAMINATE AND RESIN SPACER FOR DIMMING LAMINATE
- Publication number 20240361639
- Publication date Oct 31, 2024
- Sekisui Chemical Co., Ltd
- Yasuyuki YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTICAL BONDING PARTICLES, ADHESIVE, AND DISPLAY DEVICE
- Publication number 20230323163
- Publication date Oct 12, 2023
- Sekisui Chemical Co., Ltd
- Saori UEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIMMING LAMINATE AND RESIN SPACER FOR DIMMING LAMINATE
- Publication number 20230244108
- Publication date Aug 3, 2023
- Sekisui Chemical Co., Ltd
- Yasuyuki YAMADA
- G02 - OPTICS
Information Patent Application
GAP MATERIAL, ADHESIVE, AND DISPLAY DEVICE
- Publication number 20230140786
- Publication date May 4, 2023
- Sekisui Chemical Co., Ltd
- Saori UEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIMMING LAMINATE AND RESIN SPACER FOR DIMMING LAMINATE
- Publication number 20200348549
- Publication date Nov 5, 2020
- Sekisui Chemical Co., Ltd
- Yasuyuki YAMADA
- G02 - OPTICS
Information Patent Application
COMPOSITION FOR BONDING, OPTICAL ADHESIVE, AND ADHESIVE FOR PRESSUR...
- Publication number 20200317972
- Publication date Oct 8, 2020
- Sekisui Chemical Co., Ltd
- Saori UEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITE PARTICLES, COMPOSITE-PARTICLE POWDER, AND LIGHT-MODULATIN...
- Publication number 20200199454
- Publication date Jun 25, 2020
- Sekisui Chemical Co., Ltd.
- Yasuyuki YAMADA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
LIGHT CONTROL LAMINATE AND RESIN SPACER FOR LIGHT CONTROL LAMINATES
- Publication number 20200012138
- Publication date Jan 9, 2020
- Sekisui Chemical Co., Ltd.
- Yasuyuki Yamada
- G02 - OPTICS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR SENSOR
- Publication number 20190088573
- Publication date Mar 21, 2019
- Sekisui Chemical Co., Ltd.
- Saori UEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR SENSOR CHIP MOUNTING, AND SEMICONDUCTOR...
- Publication number 20190078002
- Publication date Mar 14, 2019
- Sekisui Chemical Co., Ltd.
- Saori UEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180318970
- Publication date Nov 8, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180301237
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180297153
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180297154
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR CURING AGENT AND/OR CURING ACCELERANT COMPLEX...
- Publication number 20150133606
- Publication date May 14, 2015
- Tadashi Iwamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SINGLE-HOLE HOLLOW POLYMER PARTICLES
- Publication number 20120189848
- Publication date Jul 26, 2012
- Sekisui Chemical Co., Ltd.
- Hiroshi Yamauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SINGLE-HOLE HOLLOW POLYMER MICROPARTICLES
- Publication number 20110223426
- Publication date Sep 15, 2011
- Hiroshi Yamauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yasuyuki Yamada

Person

Patents Grantslast 30 patents

Dimming laminate and resin spacer for dimming laminate

Dimming laminate and resin spacer for dimming laminate

Particles, connecting material and connection structure

Connecting material and connection structure

Particles, connecting material and connection structure

Particles, connecting material and connection structure

Composition for bonding, optical adhesive, and adhesive for pressur...

Adhesive for semiconductor sensor chip mounting, and semiconductor...

Adhesive for semiconductor mounting, and semiconductor sensor

Method for producing single-hole hollow polymer microparticles

Method for producing single-hole hollow polymer particles

Patents Applicationslast 30 patents

DIMMING LAMINATE AND RESIN SPACER FOR DIMMING LAMINATE

OPTICAL BONDING PARTICLES, ADHESIVE, AND DISPLAY DEVICE

DIMMING LAMINATE AND RESIN SPACER FOR DIMMING LAMINATE

GAP MATERIAL, ADHESIVE, AND DISPLAY DEVICE

DIMMING LAMINATE AND RESIN SPACER FOR DIMMING LAMINATE

COMPOSITION FOR BONDING, OPTICAL ADHESIVE, AND ADHESIVE FOR PRESSUR...

COMPOSITE PARTICLES, COMPOSITE-PARTICLE POWDER, AND LIGHT-MODULATIN...

LIGHT CONTROL LAMINATE AND RESIN SPACER FOR LIGHT CONTROL LAMINATES

ADHESIVE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR SENSOR

ADHESIVE FOR SEMICONDUCTOR SENSOR CHIP MOUNTING, AND SEMICONDUCTOR...

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

CONNECTING MATERIAL AND CONNECTION STRUCTURE

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

PRODUCTION METHOD FOR CURING AGENT AND/OR CURING ACCELERANT COMPLEX...

METHOD FOR PRODUCING SINGLE-HOLE HOLLOW POLYMER PARTICLES

METHOD FOR PRODUCING SINGLE-HOLE HOLLOW POLYMER MICROPARTICLES