Yasuyuki Yamasaki

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Kodaira, JP

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Patents Grantslast 30 patents

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Semiconductor device and process for producing the same, and lead f...
- Patent number 5,234,866
- Issue date Aug 10, 1993
- Hitachi, Ltd.
- Takayuki Okinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having inner leads extending over a surface of...
- Patent number 5,126,821
- Issue date Jun 30, 1992
- Hitachi, Ltd.
- Takayuki Okinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,943,843
- Issue date Jul 24, 1990
- Hitachi, Ltd.
- Takayuki Okinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 4,527,730
- Issue date Jul 9, 1985
- Hitachi, Ltd.
- Yuji Shirai
- H01 - BASIC ELECTRIC ELEMENTS