Yau-Ching Yang

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Hsinchu County, TW

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Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL
- Publication number 20250001546
- Publication date Jan 2, 2025
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR PRODUCING EPITAXIAL WAFERS
- Publication number 20230268186
- Publication date Aug 24, 2023
- GLOBALWAFERS CO., LTD.
- Chih-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD ASSEMBLY HAVING RECESS AND CAP
- Publication number 20230201994
- Publication date Jun 29, 2023
- GLOBALWAFERS CO., LTD.
- Chih Yuan Hsu
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT...
- Publication number 20230047412
- Publication date Feb 16, 2023
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD ASSEMBLY HAVING RECESS AND CAP
- Publication number 20220410340
- Publication date Dec 29, 2022
- GLOBALWAFERS CO., LTD.
- Peter Daniel Albrecht
- B24 - GRINDING POLISHING