Yaw-Yuh Yang

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Tainan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Heat spreader and semiconductor device package having the same
- Patent number 7,122,911
- Issue date Oct 17, 2006
- Advanced Semiconductor Engineering, Inc.
- Yaw-Yuh Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE METHOD
- Publication number 20070087480
- Publication date Apr 19, 2007
- Advanced Semiconductor Engineering, Inc.
- Su TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader and semiconductor device package having the same
- Publication number 20050104201
- Publication date May 19, 2005
- Advanced Semiconductor Engineering, Inc.
- Yaw-Yuh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader and semiconductor device package having the same
- Publication number 20050104195
- Publication date May 19, 2005
- Advanced Semiconductor Engineering, Inc.
- Yaw-Yuh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME]
- Publication number 20040124515
- Publication date Jul 1, 2004
- SU TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure with heat slug
- Publication number 20030128520
- Publication date Jul 10, 2003
- Yaw-Yuh Yang
- H01 - BASIC ELECTRIC ELEMENTS