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last 30 patents
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Patent Grant
Chip packaging structure and method for preparing same
Patent number
11,798,888
Issue date
Oct 24, 2023
SJ Semiconductor (Jiangyin) Corporation
Yayuan Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna packaging structure and method for forming the same
Patent number
11,316,252
Issue date
Apr 26, 2022
SJ Semiconductor (Jiangyin) Corporation
Chengtar Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
Publication number
20220189878
Publication date
Jun 16, 2022
SJ Semiconductor(Jiangyin) Corporation
Yayuan Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna Chip Packaging Structure And Method For Preparing Same
Publication number
20220181278
Publication date
Jun 9, 2022
SJ Semiconductor (Jiangyin) Corporation
Yayuan Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20210391637
Publication date
Dec 16, 2021
SJ Semiconductor (Jiangyin) Corporation
Chengtar WU
H01 - BASIC ELECTRIC ELEMENTS