Ye Chen

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Ota-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Affixing method and affixing apparatus
- Patent number 12,128,664
- Issue date Oct 29, 2024
- Disco Corporation
- Yohei Masuda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing method
- Patent number 11,712,747
- Issue date Aug 1, 2023
- Disco Corporation
- Ye Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for wiring board
- Patent number 10,874,021
- Issue date Dec 22, 2020
- Disco Corporation
- Ye Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
AFFIXING METHOD AND AFFIXING APPARATUS
- Publication number 20230014530
- Publication date Jan 19, 2023
- Disco Corporation
- Yohei MASUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210129260
- Publication date May 6, 2021
- Disco Corporation
- Ye CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR WIRING BOARD
- Publication number 20180103547
- Publication date Apr 12, 2018
- Disco Corporation
- Ye Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20110097875
- Publication date Apr 28, 2011
- Disco Corporation
- Yohei Gokita
- H01 - BASIC ELECTRIC ELEMENTS