Ye-Chung Chung

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and display devices including the same
- Patent number 11,133,262
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Ji Ah Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for a package substrate
- Patent number 10,903,127
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- So Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Film for package substrate, semiconductor package, display device,...
- Patent number 10,699,974
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- So Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and display devices including the same
- Patent number 10,607,939
- Issue date Mar 31, 2020
- Samsung Electronics Co., Ltd.
- Ji Ah Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source driver, an image display assembly and an image display appar...
- Patent number 10,163,942
- Issue date Dec 25, 2018
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- G02 - OPTICS
Information Patent Grant
Source driver, an image display assembly and an image display appar...
- Patent number 9,557,616
- Issue date Jan 31, 2017
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- G02 - OPTICS
Information Patent Grant
Semiconductor package
- Patent number 9,129,972
- Issue date Sep 8, 2015
- Samsung Electronics Co., Ltd.
- Young-sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 8,222,089
- Issue date Jul 17, 2012
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display driver integrated circuit device, film, and module
- Patent number 7,999,341
- Issue date Aug 16, 2011
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- G02 - OPTICS
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 7,915,727
- Issue date Mar 29, 2011
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
TAB package connecting host device element
- Patent number 7,902,647
- Issue date Mar 8, 2011
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and TAB package having the same
- Patent number 7,732,933
- Issue date Jun 8, 2010
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display driver integrated circuit device, film, and module
- Patent number 7,683,471
- Issue date Mar 23, 2010
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad arrangement of driver IC chip for LCD and related circuit patte...
- Patent number 7,652,366
- Issue date Jan 26, 2010
- Samsung Electronics Co. Ltd.
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab package connecting host device element
- Patent number 7,649,246
- Issue date Jan 19, 2010
- Samsung Electronics Co., Ltd.
- Ye-chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad arrangement of driver IC chip for LCD and related circuit patte...
- Patent number 7,459,779
- Issue date Dec 2, 2008
- Samsung Electric Co., Ltd.
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and tab package having the same
- Patent number 7,329,597
- Issue date Feb 12, 2008
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape package having test pad on reverse surface and method for test...
- Patent number 7,217,990
- Issue date May 15, 2007
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-cost flexible film package module and method of manufacturing t...
- Patent number 7,109,575
- Issue date Sep 19, 2006
- Samsung Electronics Co., Ltd.
- Sa-Yoon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape circuit substrate and semiconductor chip package using the same
- Patent number 7,087,987
- Issue date Aug 8, 2006
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film carrier tape for semiconductor package and manufacturing metho...
- Patent number 6,919,513
- Issue date Jul 19, 2005
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240258489
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Woon Bae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR A PACKAGE SUBSTRATE
- Publication number 20200303270
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- So Young LIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME
- Publication number 20200211972
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Ji Ah MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME
- Publication number 20190244906
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Ji Ah MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...
- Publication number 20190122943
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- So Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME
- Publication number 20180049324
- Publication date Feb 15, 2018
- Samsung Electronics Co., Ltd.
- Jung-eun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE DRIVER, AN IMAGE DISPLAY ASSEMBLY AND AN IMAGE DISPLAY APPAR...
- Publication number 20170092663
- Publication date Mar 30, 2017
- Samsung Electronics Co., Ltd.
- Ye-chung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME
- Publication number 20120138968
- Publication date Jun 7, 2012
- Na-Rae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source Driver, An Image Display Assembly And An Image Display Appar...
- Publication number 20120075268
- Publication date Mar 29, 2012
- Ye-Chung Chung
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICAT...
- Publication number 20120021600
- Publication date Jan 26, 2012
- Samsung Electronics Co., Ltd.
- Sang-Uk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...
- Publication number 20110143625
- Publication date Jun 16, 2011
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DRIVER INTEGRATED CIRCUIT DEVICE, FILM, AND MODULE
- Publication number 20100141617
- Publication date Jun 10, 2010
- Samsung Electronics Co., Ltd.
- Ye-chung CHUNG
- G02 - OPTICS
Information Patent Application
TAB PACKAGE CONNECTING HOST DEVICE ELEMENT
- Publication number 20100072607
- Publication date Mar 25, 2010
- Ye-chung Chung
- G02 - OPTICS
Information Patent Application
Semiconductor package
- Publication number 20100001392
- Publication date Jan 7, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Young-sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape for heat dissipating member, chip on film type semiconductor p...
- Publication number 20090273076
- Publication date Nov 5, 2009
- Kyong-sei CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate, tape package having the same, display device havi...
- Publication number 20090065934
- Publication date Mar 12, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Ye-Chung Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PAD ARRANGEMENT OF DRIVER IC CHIP FOR LCD AND RELATED CIRCUIT PATTE...
- Publication number 20080303148
- Publication date Dec 11, 2008
- Samsung Electronics Co., Ltd.
- Ye-Chung CHUNG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR CHIP AND TAB PACKAGE HAVING THE SAME
- Publication number 20080128902
- Publication date Jun 5, 2008
- Samsung Electronics Co., Ltd.
- Ye-Chung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape substrate having reinforcement layer for tape packages
- Publication number 20080063789
- Publication date Mar 13, 2008
- Ye-Chung Chung
- B32 - LAYERED PRODUCTS
Information Patent Application
Tape substrate having reinforcement layer for tape packages
- Publication number 20070042166
- Publication date Feb 22, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Ye-Chung Chung
- B32 - LAYERED PRODUCTS
Information Patent Application
Display driver integrated circuit device, film, and module
- Publication number 20070013857
- Publication date Jan 18, 2007
- Ye-chung Chung
- G02 - OPTICS
Information Patent Application
Low-cost flexible film package module and method of manufacturing t...
- Publication number 20060268213
- Publication date Nov 30, 2006
- Sa-Yoon Kang
- G02 - OPTICS
Information Patent Application
Tab package connecting host device element
- Publication number 20060267164
- Publication date Nov 30, 2006
- Ye-chung Chung
- G02 - OPTICS
Information Patent Application
Semiconductor chip and tab package having the same
- Publication number 20060113648
- Publication date Jun 1, 2006
- Ye-Chung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad arrangement of driver IC chip for LCD and related circuit patte...
- Publication number 20060097286
- Publication date May 11, 2006
- Ye-Chung Chung
- G02 - OPTICS
Information Patent Application
Tape circuit substrate and semiconductor chip package using the same
- Publication number 20050046033
- Publication date Mar 3, 2005
- Ye-Chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low-cost flexible film package module and method of manufacturing t...
- Publication number 20050040504
- Publication date Feb 24, 2005
- Sa-Yoon Kang
- G02 - OPTICS
Information Patent Application
Tape package having test pad on reverse surface and method for test...
- Publication number 20040245628
- Publication date Dec 9, 2004
- Samsung Electronics Co., Ltd.
- Ye-Chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film carrier tape for semiconductor package and manufacturing metho...
- Publication number 20040017001
- Publication date Jan 29, 2004
- Ye-Chung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ye-Chung Chung

Person

Patents Grantslast 30 patents

Semiconductor packages and display devices including the same

Film for a package substrate

Film for package substrate, semiconductor package, display device,...

Semiconductor packages and display devices including the same

Source driver, an image display assembly and an image display appar...

Source driver, an image display assembly and an image display appar...

Semiconductor package

Tape for heat dissipating member, chip on film type semiconductor p...

Display driver integrated circuit device, film, and module

Tape for heat dissipating member, chip on film type semiconductor p...

TAB package connecting host device element

Semiconductor chip and TAB package having the same

Display driver integrated circuit device, film, and module

Pad arrangement of driver IC chip for LCD and related circuit patte...

Tab package connecting host device element

Pad arrangement of driver IC chip for LCD and related circuit patte...

Semiconductor chip and tab package having the same

Tape package having test pad on reverse surface and method for test...

Low-cost flexible film package module and method of manufacturing t...

Tape circuit substrate and semiconductor chip package using the same

Film carrier tape for semiconductor package and manufacturing metho...

Patents Applicationslast 30 patents

DISPLAY DEVICE

FILM FOR A PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME

SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME

FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...

SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME

SOURCE DRIVER, AN IMAGE DISPLAY ASSEMBLY AND AN IMAGE DISPLAY APPAR...

SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME

Source Driver, An Image Display Assembly And An Image Display Appar...

METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICAT...

TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...

DISPLAY DRIVER INTEGRATED CIRCUIT DEVICE, FILM, AND MODULE

TAB PACKAGE CONNECTING HOST DEVICE ELEMENT

Semiconductor package

Tape for heat dissipating member, chip on film type semiconductor p...

Wiring substrate, tape package having the same, display device havi...

PAD ARRANGEMENT OF DRIVER IC CHIP FOR LCD AND RELATED CIRCUIT PATTE...

SEMICONDUCTOR CHIP AND TAB PACKAGE HAVING THE SAME

Tape substrate having reinforcement layer for tape packages

Tape substrate having reinforcement layer for tape packages

Display driver integrated circuit device, film, and module

Low-cost flexible film package module and method of manufacturing t...

Tab package connecting host device element

Semiconductor chip and tab package having the same

Pad arrangement of driver IC chip for LCD and related circuit patte...

Tape circuit substrate and semiconductor chip package using the same

Low-cost flexible film package module and method of manufacturing t...

Tape package having test pad on reverse surface and method for test...

Film carrier tape for semiconductor package and manufacturing metho...