Ye Wang

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Essex Junction, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Probe for pic die with related test assembly and method
- Patent number 11,002,763
- Issue date May 11, 2021
- GLOBALFOUNDRIES U.S. INC.
- Ye Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE FOR PIC DIE WITH RELATED TEST ASSEMBLY AND METHOD
- Publication number 20200049737
- Publication date Feb 13, 2020
- GLOBALFOUNDRIES INC.
- Ye Wang
- G01 - MEASURING TESTING