Yea-Zan Su

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Reinforced aluminum copper bonding pad
- Patent number 6,677,228
- Issue date Jan 13, 2004
- Taiwan Semiconductor Manufacturing Company
- Yea-Zan Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a planarized bond pad structure
- Publication number 20040110365
- Publication date Jun 10, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yea-Zan Su
- H01 - BASIC ELECTRIC ELEMENTS