Yean Ling Soon

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Butterworh, MY

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Patents Grantslast 30 patents

Information Patent Grant
Low loss high-speed interconnects
- Patent number 11,456,516
- Issue date Sep 27, 2022
- Intel Corporation
- Ling Li Ong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE
- Publication number 20230420379
- Publication date Dec 28, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS HIGH-SPEED INTERCONNECTS
- Publication number 20210184326
- Publication date Jun 17, 2021
- Intel Corporation
- Ling Li Ong
- H01 - BASIC ELECTRIC ELEMENTS