Yechung CHUNG

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate film and semiconductor package including the same
- Patent number 11,862,548
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Kyoungsuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film packages and display apparatuses including the same
- Patent number 11,508,651
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Jungeun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards including drive circuits, and related semico...
- Patent number 10,741,628
- Issue date Aug 11, 2020
- Samsung Electronics Co., Ltd.
- Minhwa Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film product, film packages and package modules using the same
- Patent number 10,304,764
- Issue date May 28, 2019
- Samsung Electronics Co., Ltd.
- Yechung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 8,823,185
- Issue date Sep 2, 2014
- Samsung Electronics Co., Ltd.
- In Won O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape wiring substrates and packages including the same
- Patent number 8,350,158
- Issue date Jan 8, 2013
- Samsung Electronics Co., Ltd.
- Yechung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 8,198,722
- Issue date Jun 12, 2012
- Samsung Electronics Co., Ltd.
- Youngsang Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD INCLUDING THE SAME
- Publication number 20250165093
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yoonseok SEO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND FINGERPRINT AUTHENTICATION CARD INCL...
- Publication number 20250166408
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yechung Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR PACKAGE CARRIER AND FINGERPRINT SENSOR PACKAGE A...
- Publication number 20250131230
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20250087562
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME
- Publication number 20250054825
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321902
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20240162213
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014092
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- YECHUNG CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME
- Publication number 20230077996
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jungeun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220173026
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Kyoungsuk YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME
- Publication number 20210074622
- Publication date Mar 11, 2021
- Samsung Electronics Co., Ltd.
- Jungeun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS INCLUDING DRIVE CIRCUITS, AND RELATED SEMICO...
- Publication number 20180026089
- Publication date Jan 25, 2018
- Samsung Electronics Co., Ltd.
- MINHWA JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME
- Publication number 20170372992
- Publication date Dec 28, 2017
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120168918
- Publication date Jul 5, 2012
- Samsung Electronics Co., Ltd.
- In Won O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20100102432
- Publication date Apr 29, 2010
- Samsung Electronics Co., Ltd.
- YoungSang CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME
- Publication number 20100038117
- Publication date Feb 18, 2010
- Yechung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yechung CHUNG

Person

Patents Grantslast 30 patents

Package substrate film and semiconductor package including the same

Chip-on-film packages and display apparatuses including the same

Printed circuit boards including drive circuits, and related semico...

Film product, film packages and package modules using the same

Semiconductor packages

Tape wiring substrates and packages including the same

Semiconductor package

Patents Applicationslast 30 patents

FINGERPRINT SENSOR PACKAGE AND SMART CARD INCLUDING THE SAME

FINGERPRINT SENSOR PACKAGE AND FINGERPRINT AUTHENTICATION CARD INCL...

FINGERPRINT SENSOR PACKAGE CARRIER AND FINGERPRINT SENSOR PACKAGE A...

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME

CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME

PACKAGE SUBSTRATE FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME

PRINTED CIRCUIT BOARDS INCLUDING DRIVE CIRCUITS, AND RELATED SEMICO...

FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME