Yee Beng Daryl Yeow

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 12,080,625
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 11,791,238
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Releasable Isolation Layer Protection
- Publication number 20230395462
- Publication date Dec 7, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Releasable Isolation Layer Protection
- Publication number 20220415753
- Publication date Dec 29, 2022
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS