Yee-Chia Yeo

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Contact formation with reduced dopant loss and increased dimensions
- Patent number 12,199,156
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and device
- Patent number 12,191,212
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Cheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,191,304
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool and method of using an embedded chamber
- Patent number 12,191,174
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source and drain engineering process for multigate devices
- Patent number 12,191,369
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor device structure
- Patent number 12,191,378
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Chun Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low Ge isolated epitaxial layer growth over nano-sheet architecture...
- Patent number 12,191,393
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing
- Patent number 12,170,228
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding
- Patent number 12,165,888
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,159,925
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices having a semiconductor material that is semimetal in bulk a...
- Patent number 12,148,816
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer source/drain region and me...
- Patent number 12,132,118
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming
- Patent number 12,119,401
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing spacing between conductive features through implantation
- Patent number 12,112,977
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with semiconductor ca...
- Patent number 12,094,757
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Kai Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method of forming
- Patent number 12,094,778
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jeng-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and methods of manufacturing semiconductor devices
- Patent number 12,087,845
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 12,087,592
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable size fin structures
- Patent number 12,087,847
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,087,578
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor source/drain regions and methods of forming the same
- Patent number 12,080,759
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photoresist removal and laser annealing
- Patent number 12,074,026
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain structures and method of forming
- Patent number 12,074,071
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an undoped region under a source/drain
- Patent number 12,068,395
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Ku Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a multi-layer epitaxial source/drain region havin...
- Patent number 12,068,322
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxy regions with large landing areas for contact plugs
- Patent number 12,057,450
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Chi Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a nano-FET semiconductor device
- Patent number 12,040,382
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Chi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,034,061
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,009,305
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR SOURCE/DRAIN REGIONS
- Publication number 20240405070
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240395810
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240395867
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHOD OF USING AN EMBEDDED CHAMBER
- Publication number 20240395581
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Having a Semiconductor Material That Is Semimetal in Bulk a...
- Publication number 20240387711
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20240387451
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A MULTILAYER SOURCE/DRAIN REGION AND ME...
- Publication number 20240387742
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240387661
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN REGIONS OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20240387629
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Structure of Semiconductor Device and Method of Formin...
- Publication number 20240387700
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20240387232
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...
- Publication number 20240387188
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING
- Publication number 20240379356
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tz-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Dopant Source/Drain Regions and Methods of Forming Same
- Publication number 20240379446
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Regions and Methods of Forming Same
- Publication number 20240379454
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR ISOLATION REGIONS
- Publication number 20240379461
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING
- Publication number 20240379355
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tz-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL
- Publication number 20240379407
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAKAGE REDUCTION BY HALO-IMP TECHNOLOGY IN MESA REGION OF NANO SHE...
- Publication number 20240379663
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SU...
- Publication number 20240377263
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tz-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240379751
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Source/Drain Contacts and Methods of Forming the Same
- Publication number 20240379781
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Hao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240371636
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Min Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSISTOR SOURCE/DRAIN REGIONS
- Publication number 20240371930
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING
- Publication number 20240371996
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240371983
- Publication date Nov 7, 2024
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Yee-Chia Yeo

Person

Patents Grantslast 30 patents

Contact formation with reduced dopant loss and increased dimensions

Semiconductor method and device

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor processing tool and method of using an embedded chamber

Source and drain engineering process for multigate devices

Fin field effect transistor device structure

Low Ge isolated epitaxial layer growth over nano-sheet architecture...

Bottom lateral expansion of contact plugs through implantation

Semiconductor device and methods of manufacturing

Method and system for bonding

Semiconductor device and method

Devices having a semiconductor material that is semimetal in bulk a...

Semiconductor device having a multilayer source/drain region and me...

Semiconductor device and methods of forming

Reducing spacing between conductive features through implantation

Method for manufacturing semiconductor device with semiconductor ca...

Fin field-effect transistor device and method of forming

System and methods of manufacturing semiconductor devices

Ambient controlled two-step thermal treatment for spin-on coating l...

Variable size fin structures

Semiconductor structure and method of forming the same

Transistor source/drain regions and methods of forming the same

Integrated photoresist removal and laser annealing

Source/drain structures and method of forming

Method for forming an undoped region under a source/drain

Method of forming a multi-layer epitaxial source/drain region havin...

Epitaxy regions with large landing areas for contact plugs

Method of forming a nano-FET semiconductor device

Method for forming semiconductor structure

Semiconductor device and method for forming the same

Patents Applicationslast 30 patents

TRANSISTOR SOURCE/DRAIN REGIONS

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

SEMICONDUCTOR PROCESSING TOOL AND METHOD OF USING AN EMBEDDED CHAMBER

Devices Having a Semiconductor Material That Is Semimetal in Bulk a...

Wafer Bonding Apparatus and Method

SEMICONDUCTOR DEVICE HAVING A MULTILAYER SOURCE/DRAIN REGION AND ME...

Semiconductor Device and Method

DEPOSITION WINDOW ENLARGEMENT

SOURCE/DRAIN REGIONS OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

Source/Drain Structure of Semiconductor Device and Method of Formin...

BONDING SYSTEM AND METHOD FOR USING THE SAME

AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING

Dual Dopant Source/Drain Regions and Methods of Forming Same

Source/Drain Regions and Methods of Forming Same

TRANSISTOR ISOLATION REGIONS

INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING

TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

LEAKAGE REDUCTION BY HALO-IMP TECHNOLOGY IN MESA REGION OF NANO SHE...

APPARATUS, SYSTEM, AND METHOD FOR MEASURING THE TEMPERATURE OF A SU...

Semiconductor Device and Method of Manufacture

Backside Source/Drain Contacts and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

TRANSISTOR SOURCE/DRAIN REGIONS

SEMICONDUCTOR DEVICE AND METHODS OF FORMING

SEMICONDUCTOR DEVICES