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Yee Ching Tam

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  • Hong Kong, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate and process for semiconductor flip chip package
    • Patent number 7,652,374
    • Issue date Jan 26, 2010
    • Chi Wah Kok
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    D flip-flop
    • Patent number 7,405,606
    • Issue date Jul 29, 2008
    • Intellectual Ventures Fund 27 LLC
    • Chi Wah Kok
    • H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

  • Information Patent Application

    Substrate and process for semiconductor flip chip package
    • Publication number 20080023829
    • Publication date Jan 31, 2008
    • Promax Technology (Hong Kong) Limited
    • Chi Wah Kok
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    D flip-flop
    • Publication number 20070229133
    • Publication date Oct 4, 2007
    • Promax Technology (Hong Kong) Limited
    • Yee Ching Tam
    • H03 - BASIC ELECTRONIC CIRCUITRY