Yee-Chung Chan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Enhanced intermetal dielectric adhesion
- Patent number 11,282,744
- Issue date Mar 22, 2022
- Systems on Silicon Manufacturing Co. Pte. Ltd.
- Pankaj Kumar Uttwani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively deglazing P205
- Patent number 8,722,545
- Issue date May 13, 2014
- STMicroelectronics Pte Ltd
- Hong-Gap Chua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED INTERMETAL DIELECTRIC ADHESION
- Publication number 20210098289
- Publication date Apr 1, 2021
- Systems on Silicon Manufacturing Co. PTE. LTD.
- Pankaj Kumar UTTWANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY DEGLAZING P205
- Publication number 20140054727
- Publication date Feb 27, 2014
- STMicroelectronics Pte Ltd
- Hong-Gap Chua
- H01 - BASIC ELECTRIC ELEMENTS