Yee Hao Ho

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Taman Sri Angsana, MY

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Patents Grantslast 30 patents

Information Patent Grant
Substrate grooves to reduce underfill fillet bridging
- Patent number 7,179,683
- Issue date Feb 20, 2007
- Intel Corporation
- Al Ling Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Substrate grooves to reduce underfill fillet bridging
- Publication number 20060046352
- Publication date Mar 2, 2006
- Al Ling Low
- H01 - BASIC ELECTRIC ELEMENTS