Yee Hsun U

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Richardson, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Automatic detection of die absence on the wire bonding machine
- Patent number 6,510,240
- Issue date Jan 21, 2003
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for maximizing interconnection integrity and reliability bet...
- Patent number 5,981,370
- Issue date Nov 9, 1999
- Texas Instruments Incorporated
- Reynaldo M. Rincon
- H01 - BASIC ELECTRIC ELEMENTS